IC,MICROCONTROLLER,32-BIT,CMOS,BGA,416PIN,PLASTIC
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | NXP |
Parts packaging code | BGA |
package instruction | BGA, BGA416,26X26,40 |
Contacts | 416 |
Reach Compliance Code | compliant |
bit size | 32 |
JESD-30 code | S-PBGA-B416 |
Humidity sensitivity level | 1 |
Number of terminals | 416 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Encapsulate equivalent code | BGA416,26X26,40 |
Package shape | SQUARE |
Package form | GRID ARRAY |
Peak Reflow Temperature (Celsius) | 225 |
power supply | 1.5,3.3,5 V |
Certification status | Not Qualified |
RAM (bytes) | 65536 |
rom(word) | 1572864 |
ROM programmability | FLASH |
speed | 114 MHz |
surface mount | YES |
technology | CMOS |
Temperature level | AUTOMOTIVE |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |