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MPC5553MZP112R2

Description
IC,MICROCONTROLLER,32-BIT,CMOS,BGA,416PIN,PLASTIC
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size4MB,66 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Download Datasheet Parametric View All

MPC5553MZP112R2 Overview

IC,MICROCONTROLLER,32-BIT,CMOS,BGA,416PIN,PLASTIC

MPC5553MZP112R2 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerNXP
Parts packaging codeBGA
package instructionBGA, BGA416,26X26,40
Contacts416
Reach Compliance Codecompliant
bit size32
JESD-30 codeS-PBGA-B416
Humidity sensitivity level1
Number of terminals416
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA416,26X26,40
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)225
power supply1.5,3.3,5 V
Certification statusNot Qualified
RAM (bytes)65536
rom(word)1572864
ROM programmabilityFLASH
speed114 MHz
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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