SPST, 4 Func, 1 Channel, CMOS, PDSO14, TSSOP-14
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | incompatible |
Maker | Rochester Electronics |
Parts packaging code | TSSOP |
package instruction | TSSOP, |
Contacts | 14 |
Reach Compliance Code | unknown |
Analog Integrated Circuits - Other Types | SPST |
JESD-30 code | R-PDSO-G14 |
JESD-609 code | e0 |
length | 5 mm |
Number of channels | 1 |
Number of functions | 4 |
Number of terminals | 14 |
Nominal off-state isolation | 50 dB |
On-state resistance matching specifications | 25 Ω |
Maximum on-state resistance (Ron) | 1050 Ω |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | TSSOP |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Certification status | Not Qualified |
Maximum seat height | 1.2 mm |
Maximum supply voltage (Vsup) | 18 V |
Minimum supply voltage (Vsup) | 3 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
Maximum disconnect time | 80 ns |
Maximum connection time | 120 ns |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | TIN LEAD |
Terminal form | GULL WING |
Terminal pitch | 0.65 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 4.4 mm |
MC14066BDTEL | MC14066BDT | |
---|---|---|
Description | SPST, 4 Func, 1 Channel, CMOS, PDSO14, TSSOP-14 | SPST, 4 Func, 1 Channel, CMOS, PDSO14, TSSOP-14 |
Is it lead-free? | Lead free | Contains lead |
Is it Rohs certified? | incompatible | conform to |
Maker | Rochester Electronics | Rochester Electronics |
Parts packaging code | TSSOP | TSSOP |
package instruction | TSSOP, | TSSOP, |
Contacts | 14 | 14 |
Reach Compliance Code | unknown | unknown |
Analog Integrated Circuits - Other Types | SPST | SPST |
JESD-30 code | R-PDSO-G14 | R-PDSO-G14 |
JESD-609 code | e0 | e4 |
length | 5 mm | 5 mm |
Number of channels | 1 | 1 |
Number of functions | 4 | 4 |
Number of terminals | 14 | 14 |
Nominal off-state isolation | 50 dB | 50 dB |
On-state resistance matching specifications | 25 Ω | 25 Ω |
Maximum on-state resistance (Ron) | 1050 Ω | 1050 Ω |
Maximum operating temperature | 125 °C | 125 °C |
Minimum operating temperature | -55 °C | -55 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | TSSOP | TSSOP |
Package shape | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED |
Certification status | Not Qualified | Not Qualified |
Maximum seat height | 1.2 mm | 1.2 mm |
Maximum supply voltage (Vsup) | 18 V | 18 V |
Minimum supply voltage (Vsup) | 3 V | 3 V |
Nominal supply voltage (Vsup) | 5 V | 5 V |
surface mount | YES | YES |
Maximum disconnect time | 80 ns | 80 ns |
Maximum connection time | 120 ns | 120 ns |
technology | CMOS | CMOS |
Temperature level | MILITARY | MILITARY |
Terminal surface | TIN LEAD | NICKEL PALLADIUM GOLD |
Terminal form | GULL WING | GULL WING |
Terminal pitch | 0.65 mm | 0.65 mm |
Terminal location | DUAL | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED |
width | 4.4 mm | 4.4 mm |
Part Number | Manufacturer | Description |
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