Multiplexers/Switches, 1 Func, CMOS, PDSO6
| Parameter Name | Attribute value |
| Maker | LRC |
| package instruction | TSSOP, TSSOP6,.08 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-PDSO-G6 |
| normal position | NO |
| Number of functions | 1 |
| Number of terminals | 6 |
| Maximum on-state resistance (Ron) | 100 Ω |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TSSOP |
| Encapsulate equivalent code | TSSOP6,.08 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| power supply | 2.5/5 V |
| Certification status | Not Qualified |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal form | GULL WING |
| Terminal pitch | 0.635 mm |
| Terminal location | DUAL |
| MC74VHC1GT66DFT2 | MC74VHC1GT66DTT3 | MC74VHC1GT66DFT1 | MC74VHC1GT66DTT1 | MC74VHC1GT66DFT4 | |
|---|---|---|---|---|---|
| Description | Multiplexers/Switches, 1 Func, CMOS, PDSO6 | Multiplexers/Switches, 1 Func, CMOS, PDSO5 | Multiplexers/Switches, 1 Func, CMOS, PDSO6, | Multiplexers/Switches, 1 Func, CMOS, PDSO5 | Multiplexers/Switches, 1 Func, CMOS, PDSO6 |
| package instruction | TSSOP, TSSOP6,.08 | TSOP, TSOP5/6,.11,37 | TSSOP, TSSOP6,.08 | TSOP, TSOP5/6,.11,37 | TSSOP, TSSOP6,.08 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| JESD-30 code | R-PDSO-G6 | R-PDSO-G5 | R-PDSO-G6 | R-PDSO-G5 | R-PDSO-G6 |
| normal position | NO | NO | NO | NO | NO |
| Number of functions | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 6 | 5 | 6 | 5 | 6 |
| Maximum on-state resistance (Ron) | 100 Ω | 100 Ω | 100 Ω | 100 Ω | 100 Ω |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | TSSOP | TSOP | TSSOP | TSOP | TSSOP |
| Encapsulate equivalent code | TSSOP6,.08 | TSOP5/6,.11,37 | TSSOP6,.08 | TSOP5/6,.11,37 | TSSOP6,.08 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| power supply | 2.5/5 V | 2.5/5 V | 2.5/5 V | 2.5/5 V | 2.5/5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal form | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 0.635 mm | 0.95 mm | 0.635 mm | 0.95 mm | 0.635 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maker | LRC | - | LRC | LRC | LRC |
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