EEWORLDEEWORLDEEWORLD

Part Number

Search

CY7C0832V-167AC

Description
256KX18 DUAL-PORT SRAM, 4ns, PQFP120, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-120
Categorystorage    storage   
File Size2MB,33 Pages
ManufacturerRochester Electronics
Websitehttps://www.rocelec.com/
Download Datasheet Parametric Compare View All

CY7C0832V-167AC Overview

256KX18 DUAL-PORT SRAM, 4ns, PQFP120, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-120

CY7C0832V-167AC Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerRochester Electronics
Parts packaging codeQFP
package instruction14 X 14 MM, 1.40 MM HEIGHT, TQFP-120
Contacts120
Reach Compliance Codeunknown
Maximum access time4 ns
Other featuresPIPELINED ARCHITECTURE
JESD-30 codeS-PQFP-G120
JESD-609 codee0
length14 mm
memory density4718592 bit
Memory IC TypeDUAL-PORT SRAM
memory width18
Humidity sensitivity level3
Number of functions1
Number of terminals120
word count262144 words
character code256000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256KX18
Package body materialPLASTIC/EPOXY
encapsulated codeLFQFP
Package shapeSQUARE
Package formFLATPACK, LOW PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusCOMMERCIAL
Maximum seat height1.6 mm
Maximum supply voltage (Vsup)3.465 V
Minimum supply voltage (Vsup)3.135 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTIN LEAD
Terminal formGULL WING
Terminal pitch0.4 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width14 mm
D ts e t
aa h e
R c e t r lc r nc
o h se Ee to is
Ma u a t r dCo o e t
n fc u e
mp n n s
R c e tr b a d d c mp n ns ae
o h se rn e
o oet r
ma ua trd u ig ete dewaes
n fcue sn i r i/ fr
h
p rh s d f m te oiia s p l r
uc a e r
o h r n l u pi s
g
e
o R c e tr waes rce td f m
r o h se
fr e rae r
o
te oiia I. Al rce t n ae
h
r nl P
g
l e rai s r
o
d n wi tea p o a o teOC
o e t h p rv l f h
h
M.
P r aetse u igoiia fcoy
at r e td sn r n la tr
s
g
ts p o rmso R c e tr e eo e
e t rga
r o h se d v lp d
ts s lt n t g aa te p o u t
e t oui s o u rne
o
rd c
me t o e c e teOC d t s e t
es r x e d h
M aa h e.
Qu l yOv riw
ai
t
e ve
• IO- 0 1
S 90
•A 92 cr ct n
S 1 0 et ai
i
o
• Qu l e Ma ua trr Ls (
ai d
n fcues it QML MI- R -
) LP F
385
53
•C a sQ Mitr
ls
lay
i
•C a sVS a eL v l
ls
p c ee
• Qu l e S p l r Ls o D sr uos( L )
ai d u pi s it f it b tr QS D
e
i
•R c e trsacic l u pir oD A a d
o h se i
r ia s p l t L n
t
e
me t aln u t a dD A sa d r s
es lid sr n L tn ad .
y
R c e tr lcrnc , L i c mmi e t
o h se Ee t is L C s o
o
tdo
t
s p ligp o u t ta s t f c so r x e t-
u pyn rd cs h t ai y u tme e p ca
s
t n fr u lya daee u loto eoiial
i s o q ai n r q a t h s r n l
o
t
g
y
s p l db id sr ma ua trr.
u pi
e yn ut
y n fcues
T eoiia ma ua trr d ts e t c o a yn ti d c me t e e t tep r r n e
h r n l n fcue’ aa h e a c mp n ig hs o u n r cs h ef ma c
g
s
o
a ds e ic t n o teR c e tr n fcue v rino ti d vc . o h se Ee t n
n p c ai s f h o h se ma ua trd eso f hs e ie R c e tr lcr -
o
o
isg aa te tep r r n eo i s mio d co p o u t t teoiia OE s e ic -
c u rne s h ef ma c ft e c n u tr rd cs o h r n l M p c a
o
s
g
t n .T pc lv le aefr eee c p r o e o l. eti mii m o ma i m rt g
i s ‘y ia’ au s r o rfrn e up s s ny C r n nmu
o
a
r xmu ai s
n
ma b b s do p o u t h rceiain d sg , i lt n o s mpetsig
y e a e n rd c c aa tr t , e in smuai , r a l e t .
z o
o
n
© 2 1 R cetr l t n s LC Al i t R sre 0 1 2 1
0 3 ohs E cr i , L . lRg s eevd 7 1 0 3
e e oc
h
T l r m r, l s v iw wrcl . m
o e n oe p ae it w . e c o
a
e
s
o ec

CY7C0832V-167AC Related Products

CY7C0832V-167AC CY7C0832V-133AXI CY7C0832V-167AXC CY7C0831V-133AC CY7C0832V-133AXC CY7C0831V-167AC CY7C0832V-133AC
Description 256KX18 DUAL-PORT SRAM, 4ns, PQFP120, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-120 256KX18 DUAL-PORT SRAM, 4.4ns, PQFP120, 14 X 14 MM, 1.40 MM HEIGHT, LEAD FREE, TQFP-120 256KX18 DUAL-PORT SRAM, 4ns, PQFP120, 14 X 14 MM, 1.40 MM HEIGHT, LEAD FREE, TQFP-120 128KX18 DUAL-PORT SRAM, 4.4ns, PQFP120, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-120 256KX18 DUAL-PORT SRAM, 4.4ns, PQFP120, 14 X 14 MM, 1.40 MM HEIGHT, LEAD FREE, TQFP-120 128KX18 DUAL-PORT SRAM, 4ns, PQFP120, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-120 256KX18 DUAL-PORT SRAM, 4.4ns, PQFP120, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-120
Parts packaging code QFP QFP QFP QFP QFP QFP QFP
package instruction 14 X 14 MM, 1.40 MM HEIGHT, TQFP-120 LFQFP, LFQFP, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-120 LFQFP, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-120 LFQFP,
Contacts 120 120 120 120 120 120 120
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown
Maximum access time 4 ns 4.4 ns 4 ns 4.4 ns 4.4 ns 4 ns 4.4 ns
Other features PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
JESD-30 code S-PQFP-G120 S-PQFP-G120 S-PQFP-G120 S-PQFP-G120 S-PQFP-G120 S-PQFP-G120 S-PQFP-G120
length 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm
memory density 4718592 bit 4718592 bit 4718592 bit 2359296 bit 4718592 bit 2359296 bit 4718592 bit
Memory IC Type DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM
memory width 18 18 18 18 18 18 18
Number of functions 1 1 1 1 1 1 1
Number of terminals 120 120 120 120 120 120 120
word count 262144 words 262144 words 262144 words 131072 words 262144 words 131072 words 262144 words
character code 256000 256000 256000 128000 256000 128000 256000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 85 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 256KX18 256KX18 256KX18 128KX18 256KX18 128KX18 256KX18
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LFQFP LFQFP LFQFP LFQFP LFQFP LFQFP LFQFP
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Certification status COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Maximum seat height 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm
Maximum supply voltage (Vsup) 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V
Minimum supply voltage (Vsup) 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.4 mm 0.4 mm 0.4 mm 0.4 mm 0.4 mm 0.4 mm 0.4 mm
Terminal location QUAD QUAD QUAD QUAD QUAD QUAD QUAD
width 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm
Is it lead-free? Contains lead - - Contains lead - Contains lead Contains lead
Is it Rohs certified? incompatible - - incompatible - incompatible incompatible
Maker Rochester Electronics Rochester Electronics Rochester Electronics - Rochester Electronics Rochester Electronics Rochester Electronics
JESD-609 code e0 - - e0 - e0 e0
Humidity sensitivity level 3 - - 3 - 3 3
Peak Reflow Temperature (Celsius) NOT SPECIFIED - - 220 - NOT SPECIFIED 220
Terminal surface TIN LEAD - - TIN LEAD - TIN LEAD TIN LEAD
Maximum time at peak reflow temperature NOT SPECIFIED - - NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
【Recruitment】RF Engineer
A chip technology company in Beijing is recruiting ( chip design engineer) [full-time or part-time]Job description:1. Responsible for the design of RF, microwave, and millimeter wave integrated circui...
芯2020 Recruitment
Bluetooth Technology Principle and Test
The first part of this article details the key technologies of Bluetooth radio frequency, baseband and protocol. The content covers Bluetooth modulation, data packet composition, frequency hopping seq...
Jacktang Wireless Connectivity
From getting started with the development board evaluation to being ready to give up
[i=s]This post was last edited by lugl4313820 on 2022-3-31 22:35[/i]I happened to see a free evaluation activity in the technical group, so I tried to apply for the evaluation of the development board...
lugl4313820 Talking
What is the principle of constant current source composed of operational amplifier and MOS?
As shown in Figure 1, the constant current source composed of an op amp and a MOS tube, adjusting the resistance of resistor R4, changes the voltage value of pin 3 of op amp U1A (not greater than 2V),...
平漂流 Analog electronics
Talk about the high and low temperature test problems of CC2640 CC1310
CC13/26XX is TI's new generation of ultra-low power multi-protocol SOC processors that support Sub1G, 2.4G private protocols, BLE, Zigbee, RF4CE and 6LowPan. CC2640 is a BLE low-power Bluetooth chip, ...
Jacktang Wireless Connectivity
Professional standards for engineers in integrated circuits, artificial intelligence, the Internet of Things, etc. have been released. Come and see if you are qualified?
[i=s]This post was last edited by Wang Daye on 2021-11-10 17:27[/i]Recently, the Ministry of Human Resources and Social Security and the Ministry of Industry and Information Technology jointly promulg...
王达业 Talking

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号