IDT70V5378S100BC8 datasheet, PDF

IDT70V5378S100BC8: DescriptionFour-Port SRAM, 32KX18, 3.6ns, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, BGA-256; Categorystorage storage; File Size390KB，29 Pages; ManufacturerIDT (Integrated Device Technology)

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IDT70V5378S100BC8 Overview

Four-Port SRAM, 32KX18, 3.6ns, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, BGA-256

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	IDT (Integrated Device Technology)
Parts packaging code	BGA
package instruction	17 X 17 MM, 1 MM PITCH, BGA-256
Contacts	256
Reach Compliance Code	not_compliant
ECCN code	3A991.B.2.B
Maximum access time	3.6 ns
Other features	PIPELINED ARCHITECTURE
Maximum clock frequency (fCLK)	100 MHz
I/O type	COMMON
JESD-30 code	S-PBGA-B256
JESD-609 code	e0
length	17 mm
memory density	589824 bit
Memory IC Type	FOUR-PORT SRAM
memory width	18
Humidity sensitivity level	3
Number of functions	1
Number of ports	4
Number of terminals	256
word count	32768 words
character code	32000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	32KX18
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	LBGA
Encapsulate equivalent code	BGA256,16X16,40
Package shape	SQUARE
Package form	GRID ARRAY, LOW PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	225
power supply	3.3 V
Certification status	Not Qualified
Maximum seat height	1.5 mm
Maximum standby current	0.015 A
Minimum standby current	3.15 V
Maximum slew rate	0.24 mA
Maximum supply voltage (Vsup)	3.45 V
Minimum supply voltage (Vsup)	3.15 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn63Pb37)
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	20
width	17 mm

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