ISD4002-180ZD datasheet, PDF - EEWORLD Datasheet

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ISD4002-180ZD: DescriptionSpeech Synthesizer With RCDG, 180s, CMOS, PBGA19, CSP-19; CategoryAnalog mixed-signal IC Consumption circuit; File Size1MB，31 Pages; ManufacturerWinbond Electronics Corporation; Websitehttp://www.winbond.com.tw

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ISD4002-180ZD Overview

Speech Synthesizer With RCDG, 180s, CMOS, PBGA19, CSP-19

ISD4002-180ZD Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Winbond Electronics Corporation
Parts packaging code	BGA
package instruction	CSP-19
Contacts	19
Reach Compliance Code	not_compliant
Commercial integrated circuit types	SPEECH SYNTHESIZER WITH RCDG
JESD-30 code	R-PBGA-B19
JESD-609 code	e0
length	6.1 mm
Number of functions	1
Number of terminals	19
Maximum operating temperature	70 °C
Minimum operating temperature	-20 °C
Package body material	PLASTIC/EPOXY
encapsulated code	VFBGA
Encapsulate equivalent code	BGA19,4X5,30
Package shape	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3 V
Certification status	Not Qualified
Maximum read time	180 s
Maximum seat height	0.85 mm
Maximum slew rate	40 mA
Maximum supply voltage (Vsup)	3.3 V
Minimum supply voltage (Vsup)	2.7 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	0.75 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	4.7 mm

ISD4002-180ZD Related Products

	ISD4002-180ZD	ISD4002-150ZD	ISD4002-120ZD	ISD4002-240ZD
Description	Speech Synthesizer With RCDG, 180s, CMOS, PBGA19, CSP-19	Speech Synthesizer With RCDG, 150s, CMOS, PBGA19, CSP-19	Speech Synthesizer With RCDG, 120s, CMOS, PBGA19, CSP-19	Speech Synthesizer With RCDG, 240s, CMOS, PBGA19, CSP-19
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Parts packaging code	BGA	BGA	BGA	BGA
package instruction	CSP-19	CSP-19	CSP-19	CSP-19
Contacts	19	19	19	19
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant
Commercial integrated circuit types	SPEECH SYNTHESIZER WITH RCDG	SPEECH SYNTHESIZER WITH RCDG	SPEECH SYNTHESIZER WITH RCDG	SPEECH SYNTHESIZER WITH RCDG
JESD-30 code	R-PBGA-B19	R-PBGA-B19	R-PBGA-B19	R-PBGA-B19
JESD-609 code	e0	e0	e0	e0
length	6.1 mm	6.1 mm	6.1 mm	6.1 mm
Number of functions	1	1	1	1
Number of terminals	19	19	19	19
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C
Minimum operating temperature	-20 °C	-20 °C	-20 °C	-20 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	VFBGA	VFBGA	VFBGA	VFBGA
Encapsulate equivalent code	BGA19,4X5,30	BGA19,4X5,30	BGA19,4X5,30	BGA19,4X5,30
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	3 V	3 V	3 V	3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum read time	180 s	150 s	120 s	240 s
Maximum seat height	0.85 mm	0.85 mm	0.85 mm	0.85 mm
Maximum slew rate	40 mA	40 mA	40 mA	40 mA
Maximum supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	BALL	BALL	BALL	BALL
Terminal pitch	0.75 mm	0.75 mm	0.75 mm	0.75 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	4.7 mm	4.7 mm	4.7 mm	4.7 mm
Maker	Winbond Electronics Corporation	-	Winbond Electronics Corporation	Winbond Electronics Corporation

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