|
MSM5116405F-50TS-K |
MSM5116405F-70TS-K |
Description |
Fast Page DRAM, 4MX4, 50ns, CMOS, PDSO26, 0.300 INCH, 1.27 MM PITCH, PLASTIC, TSOP2-26 |
Fast Page DRAM, 4MX4, 70ns, CMOS, PDSO26, 0.300 INCH, 1.27 MM PITCH, PLASTIC, TSOP2-26 |
Maker |
LAPIS Semiconductor Co., Ltd. |
LAPIS Semiconductor Co., Ltd. |
Parts packaging code |
TSOP2 |
TSOP2 |
package instruction |
SOP, TSOP24/26,.36 |
SOP, TSOP24/26,.36 |
Contacts |
26 |
26 |
Reach Compliance Code |
unknown |
unknown |
ECCN code |
EAR99 |
EAR99 |
access mode |
FAST PAGE WITH EDO |
FAST PAGE WITH EDO |
Maximum access time |
50 ns |
70 ns |
Other features |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
I/O type |
COMMON |
COMMON |
JESD-30 code |
R-PDSO-G26 |
R-PDSO-G26 |
memory density |
16777216 bit |
16777216 bit |
Memory IC Type |
FAST PAGE DRAM |
FAST PAGE DRAM |
memory width |
4 |
4 |
Number of functions |
1 |
1 |
Number of ports |
1 |
1 |
Number of terminals |
26 |
26 |
word count |
4194304 words |
4194304 words |
character code |
4000000 |
4000000 |
Operating mode |
ASYNCHRONOUS |
ASYNCHRONOUS |
Maximum operating temperature |
70 °C |
70 °C |
organize |
4MX4 |
4MX4 |
Output characteristics |
3-STATE |
3-STATE |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
SOP |
SOP |
Encapsulate equivalent code |
TSOP24/26,.36 |
TSOP24/26,.36 |
Package shape |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE |
SMALL OUTLINE |
power supply |
5 V |
5 V |
Certification status |
Not Qualified |
Not Qualified |
refresh cycle |
4096 |
4096 |
self refresh |
NO |
NO |
Maximum standby current |
0.001 A |
0.001 A |
Maximum slew rate |
0.075 mA |
0.065 mA |
Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
Minimum supply voltage (Vsup) |
4.5 V |
4.5 V |
Nominal supply voltage (Vsup) |
5 V |
5 V |
surface mount |
YES |
YES |
technology |
CMOS |
CMOS |
Temperature level |
COMMERCIAL |
COMMERCIAL |
Terminal form |
GULL WING |
GULL WING |
Terminal pitch |
1.27 mm |
1.27 mm |
Terminal location |
DUAL |
DUAL |