|
DS26401 |
DS26401N |
Description |
DATACOM, FRAMER, PBGA256, 17 X 17 MM, 1 MM PITCH, BGA-256 |
DATACOM, FRAMER, PBGA256, 17 X 17 MM, 1 MM PITCH, BGA-256 |
Is it lead-free? |
Contains lead |
Contains lead |
Is it Rohs certified? |
incompatible |
incompatible |
Maker |
Rochester Electronics |
Rochester Electronics |
Parts packaging code |
BGA |
BGA |
package instruction |
BGA, |
17 X 17 MM, 1 MM PITCH, BGA-256 |
Contacts |
256 |
256 |
Reach Compliance Code |
unknown |
unknown |
JESD-30 code |
S-PBGA-B256 |
S-PBGA-B256 |
JESD-609 code |
e0 |
e0 |
length |
17 mm |
17 mm |
Humidity sensitivity level |
NOT SPECIFIED |
NOT SPECIFIED |
Number of functions |
1 |
1 |
Number of terminals |
256 |
256 |
Maximum operating temperature |
70 °C |
85 °C |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
BGA |
BGA |
Package shape |
SQUARE |
SQUARE |
Package form |
GRID ARRAY |
GRID ARRAY |
Peak Reflow Temperature (Celsius) |
245 |
240 |
Certification status |
COMMERCIAL |
COMMERCIAL |
Maximum seat height |
1.77 mm |
1.77 mm |
Nominal supply voltage |
3.3 V |
3.3 V |
surface mount |
YES |
YES |
Telecom integrated circuit types |
FRAMER |
FRAMER |
Temperature level |
COMMERCIAL |
INDUSTRIAL |
Terminal surface |
TIN LEAD |
TIN LEAD |
Terminal form |
BALL |
BALL |
Terminal pitch |
1 mm |
1 mm |
Terminal location |
BOTTOM |
BOTTOM |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
width |
17 mm |
17 mm |