AT27C800-15JI datasheet, PDF - EEWORLD Datasheet

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AT27C800-15JI: DescriptionOTP ROM, 512KX16, 150ns, CMOS, PQCC44, PLASTIC, LCC-44; Categorystorage storage; File Size246KB，12 Pages; ManufacturerAtmel (Microchip)

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AT27C800-15JI Overview

OTP ROM, 512KX16, 150ns, CMOS, PQCC44, PLASTIC, LCC-44

AT27C800-15JI Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Atmel (Microchip)
Parts packaging code	LCC
package instruction	QCCJ, LDCC44,.7SQ
Contacts	44
Reach Compliance Code	compliant
ECCN code	EAR99
Maximum access time	150 ns
Other features	CONFIGURABLE AS 512K X 16; TTL COMPATIBLE I/O
Spare memory width	8
I/O type	COMMON
JESD-30 code	S-PQCC-J44
JESD-609 code	e0
length	16.5862 mm
memory density	8388608 bit
Memory IC Type	OTP ROM
memory width	16
Humidity sensitivity level	2
Number of functions	1
Number of terminals	44
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	512KX16
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Encapsulate equivalent code	LDCC44,.7SQ
Package shape	SQUARE
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	225
power supply	5 V
Certification status	Not Qualified
Maximum seat height	4.57 mm
Maximum standby current	0.0001 A
Maximum slew rate	0.05 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	16.5862 mm
Base Number Matches	1

AT27C800-15JI Related Products

	AT27C800-15JI	AT27C800-15JC	AT27C800-12JC	AT27C800-10JC	AT27C800-10JI	AT27C800-12JI
Description	OTP ROM, 512KX16, 150ns, CMOS, PQCC44, PLASTIC, LCC-44	OTP ROM, 512KX16, 150ns, CMOS, PQCC44, PLASTIC, LCC-44	OTP ROM, 512KX16, 120ns, CMOS, PQCC44, PLASTIC, LCC-44	OTP ROM, 512KX16, 100ns, CMOS, PQCC44, PLASTIC, LCC-44	OTP ROM, 512KX16, 100ns, CMOS, PQCC44, PLASTIC, LCC-44	OTP ROM, 512KX16, 120ns, CMOS, PQCC44, PLASTIC, LCC-44
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)
Parts packaging code	LCC	LCC	LCC	LCC	LCC	LCC
package instruction	QCCJ, LDCC44,.7SQ	QCCJ, LDCC44,.7SQ	QCCJ, LDCC44,.7SQ	QCCJ, LDCC44,.7SQ	QCCJ, LDCC44,.7SQ	QCCJ, LDCC44,.7SQ
Contacts	44	44	44	44	44	44
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	150 ns	150 ns	120 ns	100 ns	100 ns	120 ns
Other features	CONFIGURABLE AS 512K X 16; TTL COMPATIBLE I/O	CONFIGURABLE AS 512K X 16; TTL COMPATIBLE I/O	CONFIGURABLE AS 512K X 16; TTL COMPATIBLE I/O	CONFIGURABLE AS 512K X 16; TTL COMPATIBLE I/O	CONFIGURABLE AS 512K X 16; TTL COMPATIBLE I/O	CONFIGURABLE AS 512K X 16; TTL COMPATIBLE I/O
Spare memory width	8	8	8	8	8	8
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	S-PQCC-J44	S-PQCC-J44	S-PQCC-J44	S-PQCC-J44	S-PQCC-J44	S-PQCC-J44
JESD-609 code	e0	e0	e0	e0	e0	e0
length	16.5862 mm	16.5862 mm	16.5862 mm	16.5862 mm	16.5862 mm	16.5862 mm
memory density	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit
Memory IC Type	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM
memory width	16	16	16	16	16	16
Humidity sensitivity level	2	2	2	2	2	2
Number of functions	1	1	1	1	1	1
Number of terminals	44	44	44	44	44	44
word count	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words
character code	512000	512000	512000	512000	512000	512000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	70 °C	70 °C	70 °C	85 °C	85 °C
organize	512KX16	512KX16	512KX16	512KX16	512KX16	512KX16
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QCCJ	QCCJ	QCCJ	QCCJ	QCCJ	QCCJ
Encapsulate equivalent code	LDCC44,.7SQ	LDCC44,.7SQ	LDCC44,.7SQ	LDCC44,.7SQ	LDCC44,.7SQ	LDCC44,.7SQ
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	225	225	225	225	225	225
power supply	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.57 mm	4.57 mm	4.57 mm	4.57 mm	4.57 mm	4.57 mm
Maximum standby current	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A
Maximum slew rate	0.05 mA	0.05 mA	0.05 mA	0.05 mA	0.05 mA	0.05 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	J BEND	J BEND	J BEND	J BEND	J BEND	J BEND
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	16.5862 mm	16.5862 mm	16.5862 mm	16.5862 mm	16.5862 mm	16.5862 mm

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