R5F10A6CLSP datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > The embedded processor and controller> Microcontrollers and processors> R5F10A6CLSP

R5F10A6CLSP: DescriptionMICROCONTROLLER; CategoryThe embedded processor and controller Microcontrollers and processors; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

Download Datasheet Parametric Compare View All

R5F10A6CLSP Overview

MICROCONTROLLER

R5F10A6CLSP Parametric

Parameter Name	Attribute value
Maker	Renesas Electronics Corporation
package instruction	LSSOP,
Reach Compliance Code	compliant
Has ADC	YES
Other features	LG_MAX
Address bus width
bit size	16
maximum clock frequency	20 MHz
DAC channel	NO
DMA channel	NO
External data bus width
JESD-30 code	R-PDSO-G20
length	6.9 mm
Number of I/O lines	16
Number of terminals	20
On-chip program ROM width	8
Maximum operating temperature	105 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	LSSOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
RAM (bytes)	2048
rom(word)	32768
ROM programmability	FLASH
Maximum seat height	1.4 mm
speed	32 MHz
Maximum supply voltage	5.5 V
Minimum supply voltage	2.7 V
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	DUAL
width	6.7 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER
Base Number Matches	1

Preview

Download Datasheet

View All

RL78/F13, F14

User’s Manual: Hardware

16-Bit Single-Chip Microcontrollers

All information contained in these materials, including products and product specifications,

represents information on the product at the time of publication and is subject to change by

Renesas Electronics Corp. without notice. Please review the latest information published by

Renesas Electronics Corp. through various means, including the Renesas Electronics Corp.

website (http://www.renesas.com).

www.renesas.com

Rev.2.00 May 2014

Notice

Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of

semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software,

and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by you

or third parties arising from the use of these circuits, software, or information.

Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics

does not warrant that such information is error free. Renesas Electronics assumes no liability whatsoever for any damages

incurred by you resulting from errors in or omissions from the information included herein.

Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of

third parties by or arising from the use of Renesas Electronics products or technical information described in this document. No

license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of

Renesas Electronics or others.

You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part.

Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from such alteration,

modification, copy or otherwise misappropriation of Renesas Electronics product.

Renesas Electronics products are classified according to the following two quality grades: “Standard” and “High Quality”. The

recommended applications for each Renesas Electronics product depends on the product’s quality grade, as indicated below.

“Standard”:

Computers; office equipment; communications equipment; test and measurement equipment; audio and visual

equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots etc.

“High Quality”: Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anti-

crime systems; and safety equipment etc.

Renesas Electronics products are neither intended nor authorized for use in products or systems that may pose a direct threat to

human life or bodily injury (artificial life support devices or systems, surgical implantations etc.), or may cause serious property

damages (nuclear reactor control systems, military equipment etc.). You must check the quality grade of each Renesas

Electronics product before using it in a particular application. You may not use any Renesas Electronics product for any

application for which it is not intended. Renesas Electronics shall not be in any way liable for any damages or losses incurred

by you or third parties arising from the use of any Renesas Electronics product for which the product is not intended by Renesas

Electronics.

You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics,

especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation

characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or

damages arising out of the use of Renesas Electronics products beyond such specified ranges.

Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have

specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further,

Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to

guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas

Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire control and

malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation

of microcomputer software alone is very difficult, please evaluate the safety of the final products or systems manufactured by

you.

Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility

of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable laws and

regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive.

Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws

and regulations.

Renesas Electronics products and technology may not be used for or incorporated into any products or systems whose

manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. You should not use

Renesas Electronics products or technology described in this document for any purpose relating to military applications or use

by the military, including but not limited to the development of weapons of mass destruction. When exporting the Renesas

Electronics products or technology described in this document, you should comply with the applicable export control laws and

regulations and follow the procedures required by such laws and regulations.

10. It is the responsibility of the buyer or distributor of Renesas Electronics products, who distributes, disposes of, or otherwise

places the product with a third party, to notify such third party in advance of the contents and conditions set forth in this

document, Renesas Electronics assumes no responsibility for any losses incurred by you or third parties as a result of

unauthorized use of Renesas Electronics products.

11. This document may not be reproduced or duplicated in any form, in whole or in part, without prior written consent of Renesas

Electronics.

12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document

or Renesas Electronics products, or if you have any other inquiries.

(Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majority-

owned subsidiaries.

(Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.

(2012.4)

NOTES FOR CMOS DEVICES

(1) VOLTAGE APPLICATION WAVEFORM AT INPUT PIN: Waveform distortion due to input noise or a reflected

wave may cause malfunction. If the input of the CMOS device stays in the area between VIL (MAX) and VIH

(MIN) due to noise, etc., the device may malfunction. Take care to prevent chattering noise from entering the

device when the input level is fixed, and also in the transition period when the input level passes through the

area between VIL (MAX) and VIH (MIN).

(2) HANDLING OF UNUSED INPUT PINS: Unconnected CMOS device inputs can be cause of malfunction. If an

input pin is unconnected, it is possible that an internal input level may be generated due to noise, etc., causing

malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices

must be fixed high or low by using pull-up or pull-down circuitry. Each unused pin should be connected to VDD

or GND via a resistor if there is a possibility that it will be an output pin. All handling related to unused pins must

be judged separately for each device and according to related specifications governing the device.

(3) PRECAUTION AGAINST ESD: A strong electric field, when exposed to a MOS device, can cause destruction of

the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation of static

electricity as much as possible, and quickly dissipate it when it has occurred. Environmental control must be

adequate. When it is dry, a humidifier should be used. It is recommended to avoid using insulators that easily

build up static electricity. Semiconductor devices must be stored and transported in an anti-static container,

static shielding bag or conductive material. All test and measurement tools including work benches and floors

should be grounded. The operator should be grounded using a wrist strap. Semiconductor devices must not be

touched with bare hands. Similar precautions need to be taken for PW boards with mounted semiconductor

devices.

(4) STATUS BEFORE INITIALIZATION: Power-on does not necessarily define the initial status of a MOS device.

Immediately after the power source is turned ON, devices with reset functions have not yet been initialized.

Hence, power-on does not guarantee output pin levels, I/O settings or contents of registers. A device is not

initialized until the reset signal is received. A reset operation must be executed immediately after power-on for

devices with reset functions.

(5) POWER ON/OFF SEQUENCE: In the case of a device that uses different power supplies for the internal

operation and external interface, as a rule, switch on the external power supply after switching on the internal

power supply. When switching the power supply off, as a rule, switch off the external power supply and then the

internal power supply. Use of the reverse power on/off sequences may result in the application of an

overvoltage to the internal elements of the device, causing malfunction and degradation of internal elements

due to the passage of an abnormal current. The correct power on/off sequence must be judged separately for

each device and according to related specifications governing the device.

(6) INPUT OF SIGNAL DURING POWER OFF STATE : Do not input signals or an I/O pull-up power supply while

the device is not powered. The current injection that results from input of such a signal or I/O pull-up power

supply may cause malfunction and the abnormal current that passes in the device at this time may cause

degradation of internal elements. Input of signals during the power off state must be judged separately for each

device and according to related specifications governing the device.

R5F10A6CLSP Related Products

	R5F10A6CLSP	R5F10BLEKFB	R5F10ALEKFB	R5F10PGJLFB	R5F10BGDYNA	R5F10BLGLFB	R5F10PLJKFB	R5F10PPJLFB
Description	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER
package instruction	LSSOP,	LFQFP-64	LFQFP-64	LFQFP-48	HVQFN-48	LFQFP-64	LFQFP-64	LFQFP-100
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compli	compli	compli
Has ADC	YES	YES	YES	YES	YES	YES	YES	YES
bit size	16	16	16	16	16	16	16	16
maximum clock frequency	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz
DAC channel	NO	NO	NO	YES	NO	NO	YES	YES
DMA channel	NO	NO	NO	NO	NO	NO	NO	NO
JESD-30 code	R-PDSO-G20	S-PQFP-G64	S-PQFP-G64	S-PQFP-G48	S-PQCC-N48	S-PQFP-G64	S-PQFP-G64	S-PQFP-G100
length	6.9 mm	10 mm	10 mm	7 mm	7 mm	10 mm	10 mm	14 mm
Number of I/O lines	16	58	58	44	44	58	58	92
Number of terminals	20	64	64	48	48	64	64	100
On-chip program ROM width	8	8	8	8	8	8	8	8
Maximum operating temperature	105 °C	125 °C	125 °C	105 °C	150 °C	105 °C	125 °C	105 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
PWM channel	YES	YES	YES	YES	YES	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LSSOP	LFQFP	LFQFP	LFQFP	HVQCCN	LFQFP	LFQFP	LFQFP
Package shape	RECTANGULAR	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH
RAM (bytes)	2048	4096	4096	20480	3072	8192	20480	20480
rom(word)	32768	65536	65536	262144	49152	131072	262144	262144
ROM programmability	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
Maximum seat height	1.4 mm	1.6 mm	1.6 mm	1.6 mm	0.9 mm	1.6 mm	1.6 mm	1.6 mm
speed	32 MHz	24 MHz	24 MHz	32 MHz	24 MHz	32 MHz	24 MHz	32 MHz
Maximum supply voltage	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	AUTOMOTIVE	AUTOMOTIVE	INDUSTRIAL	AUTOMOTIVE	INDUSTRIAL	AUTOMOTIVE	INDUSTRIAL
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	NO LEAD	GULL WING	GULL WING	GULL WING
Terminal pitch	0.65 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm
Terminal location	DUAL	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
width	6.7 mm	10 mm	10 mm	7 mm	7 mm	10 mm	10 mm	14 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER
Maker	Renesas Electronics Corporation	-	-	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation

Recommended Resources

Resistance furnace drive and measurement circuit

STK080 audio IC circuit diagram

CMOS to Triac Interface Circuit

Simple nickel-cadmium battery charger circuit diagram using TWH8778

Grating circuit using integrated circuit

Infrared sensor automatic door control circuit using KC778B

Shortcut: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components