TC358775XBG datasheet, PDF - EEWORLD Datasheet

TC358775XBG: DescriptionMobile Peripheral Bridge Chip IC; CategoryThe embedded processor and controller Microcontrollers and processors; File Size993KB，26 Pages; ManufacturerToshiba Semiconductor; Websitehttp://toshiba-semicon-storage.com/; Environmental Compliance

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TC358775XBG Overview

Mobile Peripheral Bridge Chip IC

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Toshiba Semiconductor
package instruction	TFBGA,
Reach Compliance Code	unknown
JESD-30 code	S-PBGA-B64
length	6 mm
Number of terminals	64
Maximum operating temperature	85 °C
Minimum operating temperature	-30 °C
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Package shape	SQUARE
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Maximum seat height	1.2 mm
Maximum supply voltage	1.3 V
Minimum supply voltage	1.1 V
Nominal supply voltage	1.2 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal form	BALL
Terminal pitch	0.65 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	6 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR CIRCUIT
Base Number Matches	1

	TC358775XBG	TC358774XBG
Description	Mobile Peripheral Bridge Chip IC	Mobile Peripheral Bridge Chip IC
Is it Rohs certified?	conform to	conform to
Maker	Toshiba Semiconductor	Toshiba Semiconductor
package instruction	TFBGA,	TFBGA,
Reach Compliance Code	unknown	unknown
JESD-30 code	S-PBGA-B64	S-PBGA-B49
length	6 mm	5 mm
Number of terminals	64	49
Maximum operating temperature	85 °C	85 °C
Minimum operating temperature	-30 °C	-30 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TFBGA	TFBGA
Package shape	SQUARE	SQUARE
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED
Maximum seat height	1.2 mm	1.2 mm
Maximum supply voltage	1.3 V	1.3 V
Minimum supply voltage	1.1 V	1.1 V
Nominal supply voltage	1.2 V	1.2 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	OTHER	OTHER
Terminal form	BALL	BALL
Terminal pitch	0.65 mm	0.65 mm
Terminal location	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED
width	6 mm	5 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT

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