IC IC,D/A CONVERTER,SINGLE,14-BIT,BICMOS,DIP,28PIN, Digital to Analog Converter
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | ADI |
Reach Compliance Code | unknown |
Converter type | D/A CONVERTER |
Enter bit code | OFFSET BINARY |
JESD-30 code | R-XDIP-T28 |
JESD-609 code | e0 |
Maximum linear error (EL) | 0.012% |
Number of digits | 14 |
Number of functions | 1 |
Number of terminals | 28 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP28,.6 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 12/15,GND/-0.3 V |
Certification status | Not Qualified |
Filter level | 38535Q/M;38534H;883B |
Maximum stabilization time | 1.5 µs |
Maximum slew rate | 4 mA |
surface mount | NO |
technology | BICMOS |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Base Number Matches | 1 |
AD7536SD/883B | AD7536SE/883B | AD7536SQ/883B | AD7536TD/883B | AD7536TE/883B | |
---|---|---|---|---|---|
Description | IC IC,D/A CONVERTER,SINGLE,14-BIT,BICMOS,DIP,28PIN, Digital to Analog Converter | IC IC,D/A CONVERTER,SINGLE,14-BIT,BICMOS,LLCC,28PIN, Digital to Analog Converter | IC IC,D/A CONVERTER,SINGLE,14-BIT,BICMOS,DIP,28PIN, Digital to Analog Converter | IC IC,D/A CONVERTER,SINGLE,14-BIT,BICMOS,DIP,28PIN, Digital to Analog Converter | IC IC,D/A CONVERTER,SINGLE,14-BIT,BICMOS,LLCC,28PIN, Digital to Analog Converter |
Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | ADI | ADI | ADI | ADI | ADI |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
Converter type | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
Enter bit code | OFFSET BINARY | OFFSET BINARY | OFFSET BINARY | OFFSET BINARY | OFFSET BINARY |
JESD-30 code | R-XDIP-T28 | S-XQCC-N28 | R-XDIP-T28 | R-XDIP-T28 | S-XQCC-N28 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 |
Maximum linear error (EL) | 0.012% | 0.012% | 0.012% | 0.006% | 0.006% |
Number of digits | 14 | 14 | 14 | 14 | 14 |
Number of functions | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 28 | 28 | 28 | 28 | 28 |
Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
encapsulated code | DIP | QCCN | DIP | DIP | QCCN |
Encapsulate equivalent code | DIP28,.6 | LCC28,.45SQ | DIP28,.6 | DIP28,.6 | LCC28,.45SQ |
Package shape | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE |
Package form | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | CHIP CARRIER |
power supply | 12/15,GND/-0.3 V | 12/15,GND/-0.3 V | 12/15,GND/-0.3 V | 12/15,GND/-0.3 V | 12/15,GND/-0.3 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Filter level | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
Maximum stabilization time | 1.5 µs | 1.5 µs | 1.5 µs | 1.5 µs | 1.5 µs |
Maximum slew rate | 4 mA | 4 mA | 4 mA | 4 mA | 4 mA |
surface mount | NO | YES | NO | NO | YES |
technology | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | NO LEAD |
Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm |
Terminal location | DUAL | QUAD | DUAL | DUAL | QUAD |
Base Number Matches | 1 | 1 | 1 | - | - |