EEPROM, 512X8, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Atmel (Microchip) |
| Parts packaging code | DIP |
| package instruction | DIP, DIP8,.3 |
| Contacts | 8 |
| Reach Compliance Code | unknown |
| ECCN code | 3A001.A.2.C |
| Other features | 3-WIRE SERIAL INTERFACE |
| Spare memory width | 16 |
| Maximum clock frequency (fCLK) | 1 MHz |
| Data retention time - minimum | 100 |
| Durability | 1000000 Write/Erase Cycles |
| JESD-30 code | R-PDIP-T8 |
| JESD-609 code | e0 |
| length | 9.395 mm |
| memory density | 4096 bit |
| Memory IC Type | EEPROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 8 |
| word count | 512 words |
| character code | 512 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 512X8 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP8,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | SERIAL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 4.32 mm |
| Serial bus type | MICROWIRE |
| Maximum standby current | 0.00003 A |
| Maximum slew rate | 0.001 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| Maximum write cycle time (tWC) | 10 ms |
| write protect | SOFTWARE |
| Base Number Matches | 1 |
| AT93C66-10PM | AT93C46-10PM | AT93C56-10PM | |
|---|---|---|---|
| Description | EEPROM, 512X8, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8 | EEPROM, 128X8, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8 | EEPROM, 256X8, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible |
| Parts packaging code | DIP | DIP | DIP |
| package instruction | DIP, DIP8,.3 | DIP, DIP8,.3 | DIP, DIP8,.3 |
| Contacts | 8 | 8 | 8 |
| Reach Compliance Code | unknown | compliant | unknown |
| ECCN code | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| Other features | 3-WIRE SERIAL INTERFACE | 3-WIRE SERIAL INTERFACE | 3-WIRE SERIAL INTERFACE |
| Spare memory width | 16 | 16 | 16 |
| Maximum clock frequency (fCLK) | 1 MHz | 1 MHz | 1 MHz |
| Data retention time - minimum | 100 | 100 | 100 |
| Durability | 1000000 Write/Erase Cycles | 100000 Write/Erase Cycles | 1000000 Write/Erase Cycles |
| JESD-30 code | R-PDIP-T8 | R-PDIP-T8 | R-PDIP-T8 |
| JESD-609 code | e0 | e0 | e0 |
| length | 9.395 mm | 9.395 mm | 9.395 mm |
| memory density | 4096 bit | 1024 bit | 2048 bit |
| Memory IC Type | EEPROM | EEPROM | EEPROM |
| memory width | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 |
| Number of terminals | 8 | 8 | 8 |
| word count | 512 words | 128 words | 256 words |
| character code | 512 | 128 | 256 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C |
| organize | 512X8 | 128X8 | 256X8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP8,.3 | DIP8,.3 | DIP8,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE |
| Parallel/Serial | SERIAL | SERIAL | SERIAL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | 3/5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 4.32 mm | 4.32 mm | 4.32 mm |
| Serial bus type | MICROWIRE | MICROWIRE | MICROWIRE |
| Maximum standby current | 0.00003 A | 0.0003 A | 0.00003 A |
| Maximum slew rate | 0.001 mA | 0.001 mA | 0.001 mA |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO |
| technology | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 7.62 mm | 7.62 mm | 7.62 mm |
| Maximum write cycle time (tWC) | 10 ms | 10 ms | 10 ms |
| write protect | SOFTWARE | SOFTWARE | SOFTWARE |
| Base Number Matches | 1 | 1 | 1 |
| Maker | Atmel (Microchip) | - | Atmel (Microchip) |
RF/Wirelessly
Discrete Device
Test/Measurement
ST - Low Power RF
Wireless Connectivity
Microcontroller MCU
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