64M X 8 FLASH 1.8V PROM, 15000 ns, PBGA63
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | Numonyx ( Micron ) |
Parts packaging code | BGA |
package instruction | TFBGA, BGA63,10X12,32 |
Contacts | 63 |
Reach Compliance Code | unknow |
ECCN code | 3A991.B.1.A |
Maximum access time | 12000 ns |
command user interface | YES |
Data polling | NO |
JESD-30 code | R-PBGA-B63 |
length | 11 mm |
memory density | 536870912 bi |
Memory IC Type | FLASH |
memory width | 8 |
Number of functions | 1 |
Number of departments/size | 4K |
Number of terminals | 63 |
word count | 67108864 words |
character code | 64000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 64MX8 |
Package body material | PLASTIC/EPOXY |
encapsulated code | TFBGA |
Encapsulate equivalent code | BGA63,10X12,32 |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, THIN PROFILE, FINE PITCH |
page size | 512 words |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 3/3.3 V |
Programming voltage | 3 V |
Certification status | Not Qualified |
ready/busy | YES |
Maximum seat height | 1.05 mm |
Department size | 16K |
Maximum standby current | 0.00005 A |
Maximum slew rate | 0.015 mA |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 2.7 V |
Nominal supply voltage (Vsup) | 3 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal form | BALL |
Terminal pitch | 0.8 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
switch bit | NO |
type | SLC NAND TYPE |
width | 9 mm |