CY7C1335L-60AC datasheet, PDF - EEWORLD Datasheet

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CY7C1335L-60AC: DescriptionCache SRAM, 32KX32, 10ns, CMOS, PQFP100, PLASTIC, TQFP-100; Categorystorage storage; File Size898KB，15 Pages; ManufacturerCypress Semiconductor

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CY7C1335L-60AC Overview

Cache SRAM, 32KX32, 10ns, CMOS, PQFP100, PLASTIC, TQFP-100

CY7C1335L-60AC Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Parts packaging code	QFP
package instruction	PLASTIC, TQFP-100
Contacts	100
Reach Compliance Code	not_compliant
ECCN code	EAR99
Maximum access time	10 ns
I/O type	COMMON
JESD-30 code	S-PQFP-G100
JESD-609 code	e0
length	14 mm
memory density	1048576 bit
Memory IC Type	CACHE SRAM
memory width	32
Number of functions	1
Number of ports	1
Number of terminals	100
word count	32768 words
character code	32000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	32KX32
Output characteristics	3-STATE
Exportable	YES
Package body material	PLASTIC/EPOXY
encapsulated code	LFQFP
Encapsulate equivalent code	QFP100,.63SQ,20
Package shape	SQUARE
Package form	FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3.3 V
Certification status	Not Qualified
Maximum seat height	1.6 mm
Maximum standby current	0.0002 A
Minimum standby current	3.14 V
Maximum slew rate	0.21 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3.135 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	14 mm
Base Number Matches	1

CY7C1335L-60AC Related Products

	CY7C1335L-60AC	CY7C1335-66AC
Description	Cache SRAM, 32KX32, 10ns, CMOS, PQFP100, PLASTIC, TQFP-100	Cache SRAM, 32KX32, 8.5ns, CMOS, PQFP100, PLASTIC, TQFP-100
Is it lead-free?	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible
Parts packaging code	QFP	QFP
package instruction	PLASTIC, TQFP-100	PLASTIC, TQFP-100
Contacts	100	100
Reach Compliance Code	not_compliant	_compli
ECCN code	EAR99	EAR99
Maximum access time	10 ns	8.5 ns
I/O type	COMMON	COMMON
JESD-30 code	S-PQFP-G100	S-PQFP-G100
JESD-609 code	e0	e0
length	14 mm	14 mm
memory density	1048576 bit	1048576 bi
Memory IC Type	CACHE SRAM	CACHE SRAM
memory width	32	32
Number of functions	1	1
Number of ports	1	1
Number of terminals	100	100
word count	32768 words	32768 words
character code	32000	32000
Operating mode	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C
organize	32KX32	32KX32
Output characteristics	3-STATE	3-STATE
Exportable	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFQFP	LFQFP
Encapsulate equivalent code	QFP100,.63SQ,20	QFP100,.63SQ,20
Package shape	SQUARE	SQUARE
Package form	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	240
power supply	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified
Maximum seat height	1.6 mm	1.6 mm
Maximum standby current	0.0002 A	0.0015 A
Minimum standby current	3.14 V	3.14 V
Maximum slew rate	0.21 mA	0.23 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3.135 V	3.135 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	GULL WING
Terminal pitch	0.5 mm	0.5 mm
Terminal location	QUAD	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	30
width	14 mm	14 mm
Base Number Matches	1	1

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