CY7C1414AV18-200BZXC datasheet, PDF

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CY7C1414AV18-200BZXC: Description1MX36 QDR SRAM, 0.45ns, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165; Categorystorage storage; File Size1MB，28 Pages; ManufacturerRochester Electronics; Websitehttps://www.rocelec.com/; Environmental Compliance

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CY7C1414AV18-200BZXC Overview

1MX36 QDR SRAM, 0.45ns, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165

CY7C1414AV18-200BZXC Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Parts packaging code	BGA
package instruction	15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165
Contacts	165
Reach Compliance Code	unknown
Maximum access time	0.45 ns
Other features	PIPELINED ARCHITECTURE
JESD-30 code	R-PBGA-B165
JESD-609 code	e1
length	17 mm
memory density	37748736 bit
Memory IC Type	QDR SRAM
memory width	36
Humidity sensitivity level	3
Number of functions	1
Number of terminals	165
word count	1048576 words
character code	1000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	1MX36
Package body material	PLASTIC/EPOXY
encapsulated code	LBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
Certification status	COMMERCIAL
Maximum seat height	1.4 mm
Maximum supply voltage (Vsup)	1.9 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
Temperature level	COMMERCIAL
Terminal surface	TIN SILVER COPPER
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	20
width	15 mm
Base Number Matches	1

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Description	1MX36 QDR SRAM, 0.45ns, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165	2MX18 QDR SRAM, 0.45ns, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	1MX36 QDR SRAM, 0.45ns, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	1MX36 QDR SRAM, 0.5ns, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	2MX18 QDR SRAM, 0.45ns, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	2MX18 QDR SRAM, 0.45ns, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	1MX36 QDR SRAM, 0.45ns, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
Is it lead-free?	Lead free	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	conform to	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	BGA	BGA	BGA	BGA	BGA	BGA	BGA
package instruction	15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165	15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	LBGA,
Contacts	165	165	165	165	165	165	165
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Maximum access time	0.45 ns	0.45 ns	0.45 ns	0.5 ns	0.45 ns	0.45 ns	0.45 ns
Other features	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE
JESD-30 code	R-PBGA-B165	R-PBGA-B165	R-PBGA-B165	R-PBGA-B165	R-PBGA-B165	R-PBGA-B165	R-PBGA-B165
JESD-609 code	e1	e0	e0	e0	e0	e0	e0
length	17 mm	17 mm	17 mm	17 mm	17 mm	17 mm	17 mm
memory density	37748736 bit	37748736 bit	37748736 bit	37748736 bit	37748736 bit	37748736 bit	37748736 bit
Memory IC Type	QDR SRAM	QDR SRAM	QDR SRAM	QDR SRAM	QDR SRAM	QDR SRAM	QDR SRAM
memory width	36	18	36	36	18	18	36
Humidity sensitivity level	3	3	3	3	3	3	3
Number of functions	1	1	1	1	1	1	1
Number of terminals	165	165	165	165	165	165	165
word count	1048576 words	2097152 words	1048576 words	1048576 words	2097152 words	2097152 words	1048576 words
character code	1000000	2000000	1000000	1000000	2000000	2000000	1000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	85 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	1MX36	2MX18	1MX36	1MX36	2MX18	2MX18	1MX36
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LBGA	LBGA	LBGA	LBGA	LBGA	LBGA	LBGA
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	260	220	220	220	220	220	220
Certification status	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Maximum seat height	1.4 mm	1.4 mm	1.4 mm	1.4 mm	1.4 mm	1.4 mm	1.4 mm
Maximum supply voltage (Vsup)	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V
Minimum supply voltage (Vsup)	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V
Nominal supply voltage (Vsup)	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
surface mount	YES	YES	YES	YES	YES	YES	YES
Temperature level	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	TIN SILVER COPPER	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	20	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	15 mm	15 mm	15 mm	15 mm	15 mm	15 mm	15 mm
Base Number Matches	1	1	1	1	-	-	-

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