CY7C008V-20AI datasheet, PDF - EEWORLD Datasheet

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CY7C008V-20AI: DescriptionDual-Port SRAM, 64KX8, 20ns, CMOS, PQFP100, PLASTIC, TQFP-100; Categorystorage storage; File Size313KB，17 Pages; ManufacturerCypress Semiconductor

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CY7C008V-20AI Overview

Dual-Port SRAM, 64KX8, 20ns, CMOS, PQFP100, PLASTIC, TQFP-100

CY7C008V-20AI Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Parts packaging code	QFP
package instruction	PLASTIC, TQFP-100
Contacts	100
Reach Compliance Code	compliant
ECCN code	3A991.B.2.B
Maximum access time	20 ns
Other features	AUTOMATIC POWER-DOWN
I/O type	COMMON
JESD-30 code	S-PQFP-G100
JESD-609 code	e0
memory density	524288 bit
Memory IC Type	DUAL-PORT SRAM
memory width	8
Humidity sensitivity level	3
Number of functions	1
Number of ports	2
Number of terminals	100
word count	65536 words
character code	64000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	64KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	QFP
Encapsulate equivalent code	QFP100,.63SQ,20
Package shape	SQUARE
Package form	FLATPACK
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	225
power supply	3.3 V
Certification status	Not Qualified
Maximum standby current	0.0001 A
Minimum standby current	3 V
Maximum slew rate	0.195 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	30
Base Number Matches	1

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Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	QFP	QFP	QFP	QFP	QFP	QFP
package instruction	PLASTIC, TQFP-100	PLASTIC, TQFP-100	PLASTIC, TQFP-100	PLASTIC, TQFP-100	PLASTIC, TQFP-100	PLASTIC, TQFP-100
Contacts	100	100	100	100	100	100
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant
ECCN code	3A991.B.2.B	3A991.B.2.A	EAR99	EAR99	3A991.B.2.B	EAR99
Maximum access time	20 ns	25 ns	25 ns	25 ns	20 ns	25 ns
Other features	AUTOMATIC POWER-DOWN	INTERRUPT FLAG	INTERRUPT FLAG	INTERRUPT FLAG	AUTOMATIC POWER-DOWN	INTERRUPT FLAG
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100
JESD-609 code	e0	e0	e0	e0	e0	e0
memory density	524288 bit	1179648 bit	1048576 bit	589824 bit	589824 bit	524288 bit
Memory IC Type	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM
memory width	8	9	8	9	9	8
Humidity sensitivity level	3	3	3	3	3	3
Number of functions	1	1	1	1	1	1
Number of ports	2	2	2	2	2	2
Number of terminals	100	100	100	100	100	100
word count	65536 words	131072 words	131072 words	65536 words	65536 words	65536 words
character code	64000	128000	128000	64000	64000	64000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	64KX8	128KX9	128KX8	64KX9	64KX9	64KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QFP	QFP	QFP	QFP	QFP	QFP
Encapsulate equivalent code	QFP100,.63SQ,20	QFP100,.63SQ,20	QFP100,.63SQ,20	QFP100,.63SQ,20	QFP100,.63SQ,20	QFP100,.63SQ,20
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	FLATPACK	FLATPACK	FLATPACK	FLATPACK	FLATPACK	FLATPACK
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	225	225	225	225	225	225
power supply	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum standby current	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A
Minimum standby current	3 V	2 V	2 V	2 V	3 V	2 V
Maximum slew rate	0.195 mA	0.185 mA	0.185 mA	0.185 mA	0.195 mA	0.185 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	30	30	30	30	30	30
Maker	-	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor
Exportable	-	YES	YES	YES	-	YES

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