OTP ROM, 512X8, 70ns, Bipolar, CDIP20, CERAMIC, DIP-20
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Parts packaging code | DIP |
package instruction | DIP, DIP20,.3 |
Contacts | 20 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Maximum access time | 70 ns |
JESD-30 code | R-GDIP-T20 |
JESD-609 code | e0 |
length | 24.257 mm |
memory density | 4096 bit |
Memory IC Type | OTP ROM |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 20 |
word count | 512 words |
character code | 512 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
organize | 512X8 |
Output characteristics | 3-STATE |
Package body material | CERAMIC, GLASS-SEALED |
encapsulated code | DIP |
Encapsulate equivalent code | DIP20,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | PARALLEL |
power supply | 5 V |
Certification status | Not Qualified |
Filter level | 38535Q/M;38534H;883B |
Maximum seat height | 5.08 mm |
Maximum slew rate | 0.16 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | BIPOLAR |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
width | 7.62 mm |
Base Number Matches | 1 |
AM27S29/BRA | AM27S29SA/BSA | AM27S29SA/BRA | AM27S29/BSA | AM27S29/B2A | AM27S29A/BRA | AM27S29A/B2A | AM27S29SA/B2A | AM27S29A/BSA | |
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Description | OTP ROM, 512X8, 70ns, Bipolar, CDIP20, CERAMIC, DIP-20 | OTP ROM, 512X8, 40ns, Bipolar, CDFP20, CERAMIC, FP-20 | OTP ROM, 512X8, 40ns, Bipolar, CDIP20, CERAMIC, DIP-20 | OTP ROM, 512X8, 70ns, Bipolar, CDFP20, CERAMIC, FP-20 | OTP ROM, 512X8, 70ns, Bipolar, CQCC20, CERAMIC, LCC-20 | OTP ROM, 512X8, 45ns, Bipolar, CDIP20, CERAMIC, DIP-20 | OTP ROM, 512X8, 45ns, Bipolar, CQCC20, CERAMIC, LCC-20 | OTP ROM, 512X8, 40ns, Bipolar, CQCC20, CERAMIC, LCC-20 | OTP ROM, 512X8, 45ns, Bipolar, CDFP20, CERAMIC, FP-20 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Parts packaging code | DIP | DFP | DIP | DFP | QLCC | DIP | QLCC | QLCC | DFP |
package instruction | DIP, DIP20,.3 | DFP, FL20,.3 | DIP, DIP20,.3 | DFP, FL20,.3 | QCCN, LCC20,.35SQ | CERAMIC, DIP-20 | QCCN, LCC20,.35SQ | QCCN, LCC20,.35SQ | DFP, FL20,.3 |
Contacts | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
Maximum access time | 70 ns | 40 ns | 40 ns | 70 ns | 70 ns | 45 ns | 45 ns | 40 ns | 45 ns |
JESD-30 code | R-GDIP-T20 | R-GDFP-F20 | R-GDIP-T20 | R-GDFP-F20 | S-CQCC-N20 | R-GDIP-T20 | S-CQCC-N20 | S-CQCC-N20 | R-GDFP-F20 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
length | 24.257 mm | 13.0175 mm | 24.257 mm | 13.0175 mm | 8.89 mm | 24.257 mm | 8.89 mm | 8.89 mm | 13.0175 mm |
memory density | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit |
Memory IC Type | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
word count | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words |
character code | 512 | 512 | 512 | 512 | 512 | 512 | 512 | 512 | 512 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
organize | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
encapsulated code | DIP | DFP | DIP | DFP | QCCN | DIP | QCCN | QCCN | DFP |
Encapsulate equivalent code | DIP20,.3 | FL20,.3 | DIP20,.3 | FL20,.3 | LCC20,.35SQ | DIP20,.3 | LCC20,.35SQ | LCC20,.35SQ | FL20,.3 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR |
Package form | IN-LINE | FLATPACK | IN-LINE | FLATPACK | CHIP CARRIER | IN-LINE | CHIP CARRIER | CHIP CARRIER | FLATPACK |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Filter level | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
Maximum seat height | 5.08 mm | 2.286 mm | 5.08 mm | 2.286 mm | 2.54 mm | 5.08 mm | 2.54 mm | 2.54 mm | 2.286 mm |
Maximum slew rate | 0.16 mA | 0.16 mA | 0.16 mA | 0.16 mA | 0.16 mA | 0.16 mA | 0.16 mA | 0.16 mA | 0.16 mA |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | YES | NO | YES | YES | NO | YES | YES | YES |
technology | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | FLAT | THROUGH-HOLE | FLAT | NO LEAD | THROUGH-HOLE | NO LEAD | NO LEAD | FLAT |
Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | QUAD | DUAL | QUAD | QUAD | DUAL |
width | 7.62 mm | 6.731 mm | 7.62 mm | 6.731 mm | 8.89 mm | 7.62 mm | 8.89 mm | 8.89 mm | 6.731 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | - | - | - | - |