16 Mbit and 32 Mbit (x16, Multiple Bank, Burst) 1.8V supply Flash memories
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | Numonyx ( Micron ) |
Parts packaging code | BGA |
package instruction | VFBGA, BGA56,7X8,30 |
Contacts | 56 |
Reach Compliance Code | unknow |
ECCN code | 3A991.B.1.A |
Maximum access time | 70 ns |
Other features | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE |
startup block | TOP |
command user interface | YES |
Universal Flash Interface | YES |
Data polling | NO |
JESD-30 code | R-PBGA-B56 |
JESD-609 code | e1 |
length | 9 mm |
memory density | 33554432 bi |
Memory IC Type | FLASH |
memory width | 16 |
Number of functions | 1 |
Number of departments/size | 8,63 |
Number of terminals | 56 |
word count | 2097152 words |
character code | 2000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 2MX16 |
Package body material | PLASTIC/EPOXY |
encapsulated code | VFBGA |
Encapsulate equivalent code | BGA56,7X8,30 |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
page size | 4 words |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 1.8,1.8/2 V |
Programming voltage | 1.8 V |
Certification status | Not Qualified |
Maximum seat height | 1 mm |
Department size | 4K,32K |
Maximum standby current | 0.00005 A |
Maximum slew rate | 0.045 mA |
Maximum supply voltage (Vsup) | 2 V |
Minimum supply voltage (Vsup) | 1.7 V |
Nominal supply voltage (Vsup) | 1.8 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal form | BALL |
Terminal pitch | 0.75 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
switch bit | NO |
type | NOR TYPE |
width | 7.7 mm |