AM29LV160DT-70EF datasheet, PDF

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AM29LV160DT-70EF: Description1MX16 FLASH 3V PROM, 70ns, PDSO48, LEAD FREE, MO-142DD, TSOP-48; Categorystorage storage; File Size2MB，52 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/; Environmental Compliance

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AM29LV160DT-70EF Overview

1MX16 FLASH 3V PROM, 70ns, PDSO48, LEAD FREE, MO-142DD, TSOP-48

AM29LV160DT-70EF Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Parts packaging code	TSOP1
package instruction	TSOP1, TSSOP48,.8,20
Contacts	48
Reach Compliance Code	compliant
Maximum access time	70 ns
Other features	TOP BOOT BLOCK
Spare memory width	8
startup block	TOP
command user interface	YES
Universal Flash Interface	YES
Data polling	YES
JESD-30 code	R-PDSO-G48
JESD-609 code	e3
length	18.4 mm
memory density	16777216 bit
Memory IC Type	FLASH
memory width	16
Humidity sensitivity level	3
Number of functions	1
Number of departments/size	1,2,1,31
Number of terminals	48
word count	1048576 words
character code	1000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	1MX16
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP1
Encapsulate equivalent code	TSSOP48,.8,20
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
power supply	3/3.3 V
Programming voltage	3 V
Certification status	Not Qualified
ready/busy	YES
Maximum seat height	1.2 mm
Department size	16K,8K,32K,64K
Maximum standby current	0.000005 A
Maximum slew rate	0.03 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Matte Tin (Sn)
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	40
switch bit	YES
type	NOR TYPE
width	12 mm
Base Number Matches	1

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Am29LV160D

Data Sheet

RETIRED

PRODUCT

This product has been retired and is not recommended for designs. For new and current designs,

S29AL016D supersedes Am29LV160D and is the factory-recommended migration path for this

device. Please refer to the S29AL016D data sheet for specifications and ordering information. Avail-

ability of this document is retained for reference and historical purposes only.

The following document contains information on Spansion memory products.

Continuity of Specifications

There is no change to this data sheet as a result of offering the device as a Spansion product. Any

changes that have been made are the result of normal data sheet improvement and are noted in the

document revision summary.

For More Information

Please contact your local sales office for additional information about Spansion memory solutions.

Publication Number

22358

Revision

Amendment

Issue Date

May 5, 2006

D A T A

S H E E T

TABLE OF CONTENTS

Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 4

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . 5

Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 8

Device Bus Operations . . . . . . . . . . . . . . . . . . . . . . 9

Table 1. Am29LV160D Device Bus Operations ................................9

DQ3: Sector Erase Timer ....................................................... 28

Table 10. Write Operation Status ................................................... 28

Absolute Maximum Ratings . . . . . . . . . . . . . . . . 29

Figure 7. Maximum Negative Overshoot Waveform ...................... 30

Figure 8. Maximum Positive Overshoot Waveform........................ 30

Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . 30

DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 31

Figure 9. I

CC1

Current vs. Time (Showing Active and

Automatic Sleep Currents) ............................................................. 32

Figure 10. Typical I

CC1

vs. Frequency ........................................... 32

Word/Byte Configuration .......................................................... 9

Requirements for Reading Array Data ..................................... 9

Writing Commands/Command Sequences .............................. 9

Program and Erase Operation Status .................................... 10

Standby Mode ........................................................................ 10

Automatic Sleep Mode ........................................................... 10

RESET#: Hardware Reset Pin ............................................... 11

Output Disable Mode .............................................................. 11

Table 2. Sector Address Tables (Am29LV160DT) ..........................12

Table 3. Sector Address Tables (Am29LV160DB) ..........................13

Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 33

Figure 11. Test Setup..................................................................... 33

Table 11. Test Specifications ......................................................... 33

Figure 12. Input Waveforms and Measurement Levels ................. 33

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 34

Read Operations .................................................................... 34

Figure 13. Read Operations Timings ............................................. 34

Hardware Reset (RESET#) .................................................... 35

Figure 14. RESET# Timings .......................................................... 35

Autoselect Mode ..................................................................... 14

Table 4. Am29LV160D Autoselect Codes (High Voltage Method) ..14

Word/Byte Configuration (BYTE#) ........................................ 36

Figure 15. BYTE# Timings for Read Operations............................ 36

Figure 16. BYTE# Timings for Write Operations............................ 36

Sector Protection/Unprotection ............................................... 14

Temporary Sector Unprotect .................................................. 15

Figure 1. Temporary Sector Unprotect Operation........................... 15

Figure 2. In-System Sector Protect/Unprotect Algorithms .............. 16

Erase/Program Operations ..................................................... 37

Figure 17. Program Operation Timings..........................................

Figure 18. Chip/Sector Erase Operation Timings ..........................

Figure 19. Data# Polling Timings (During Embedded Algorithms).

Figure 20. Toggle Bit Timings (During Embedded Algorithms)......

Figure 21. DQ2 vs. DQ6 for Erase and

Erase Suspend Operations ............................................................

Figure 22. Temporary Sector Unprotect/Timing Diagram ..............

Figure 23. Sector Protect/Unprotect Timing Diagram ....................

Figure 24. Alternate CE# Controlled Write Operation Timings ......

Common Flash Memory Interface (CFI) . . . . . . . 17

Table 5. CFI Query Identification String ..........................................17

Table 6. System Interface String .....................................................18

Table 7. Device Geometry Definition ..............................................18

Table 8. Primary Vendor-Specific Extended Query ........................19

Hardware Data Protection ...................................................... 19

Low V

Write Inhibit .............................................................. 19

Write Pulse “Glitch” Protection ............................................... 19

Logical Inhibit .......................................................................... 19

Power-Up Write Inhibit ............................................................ 19

Command Definitions . . . . . . . . . . . . . . . . . . . . . . 20

Reading Array Data ................................................................ 20

Reset Command ..................................................................... 20

Autoselect Command Sequence ............................................ 20

Word/Byte Program Command Sequence ............................. 20

Unlock Bypass Command Sequence ..................................... 21

Figure 3. Program Operation .......................................................... 21

Chip Erase Command Sequence ........................................... 21

Sector Erase Command Sequence ........................................ 22

Erase Suspend/Erase Resume Commands ........................... 22

Figure 4. Erase Operation............................................................... 23

Command Definitions ............................................................. 24

Table 9. Am29LV160D Command Definitions ................................24

Write Operation Status . . . . . . . . . . . . . . . . . . . . . 25

DQ7: Data# Polling ................................................................. 25

Figure 5. Data# Polling Algorithm ................................................... 25

RY/BY#: Ready/Busy# ........................................................... 26

DQ6: Toggle Bit I .................................................................... 26

DQ2: Toggle Bit II ................................................................... 26

Reading Toggle Bits DQ6/DQ2 .............................................. 26

Figure 6. Toggle Bit Algorithm......................................................... 27

Erase and Programming Performance . . . . . . . 45

Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 45

TSOP and SO Pin Capacitance . . . . . . . . . . . . . . 45

Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 46

TS 048—48-Pin Standard TSOP ............................................ 46

TSR048—48-Pin Reverse TSOP ........................................... 47

FBC048—48-Ball Fine-Pitch Ball Grid Array (FBGA)

8 x 9 mm ................................................................................ 48

SO 044—44-Pin Small Outline Package ................................ 49

Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 50

Revision A (January 1999) ..................................................... 50

Revision A+1 (April 19, 1999) ................................................. 50

Revision B (November 23, 1999) ............................................ 50

Revision B+1 (February 22, 2000) .......................................... 50

Revision B+2 (November 7, 2000) ......................................... 50

Revision B+3 (November 10, 2000) ....................................... 50

Revision B+4 (April 5, 2004) ................................................... 50

Revision B+5 (June 4, 2004) .................................................. 50

Revision B+6 (October 7, 2004) ............................................. 50

Revision B7 (May 5, 2006) ..................................................... 50

22358B7 May 5, 2006

Am29LV160D

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