AM29LV160BB-80WCF datasheet, PDF

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AM29LV160BB-80WCF: Description1MX16 FLASH 3V PROM, 80ns, PBGA48, 8 X 9 MM, 0.80 MM PITCH, LEAD FREE, FBGA-48; Categorystorage storage; File Size1MB，54 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/; Environmental Compliance

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AM29LV160BB-80WCF Overview

1MX16 FLASH 3V PROM, 80ns, PBGA48, 8 X 9 MM, 0.80 MM PITCH, LEAD FREE, FBGA-48

AM29LV160BB-80WCF Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Parts packaging code	BGA
package instruction	TFBGA, BGA48,6X8,32
Contacts	48
Reach Compliance Code	compliant
Maximum access time	80 ns
Other features	BOTTOM BOOT BLOCK
Spare memory width	8
startup block	BOTTOM
command user interface	YES
Universal Flash Interface	YES
Data polling	YES
JESD-30 code	R-PBGA-B48
JESD-609 code	e1
length	9 mm
memory density	16777216 bit
Memory IC Type	FLASH
memory width	16
Humidity sensitivity level	3
Number of functions	1
Number of departments/size	1,2,1,31
Number of terminals	48
word count	1048576 words
character code	1000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	1MX16
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Encapsulate equivalent code	BGA48,6X8,32
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
power supply	3/3.3 V
Programming voltage	3 V
Certification status	Not Qualified
ready/busy	YES
Maximum seat height	1.2 mm
Department size	16K,8K,32K,64K
Maximum standby current	0.000005 A
Maximum slew rate	0.03 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40
switch bit	YES
type	NOR TYPE
width	8 mm
Base Number Matches	1

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Am29LV160B

Data Sheet

RETIRED

PRODUCT

This product has been retired and is not recommended for designs. For new and current designs,

S29AL016D

supersedes

Am29LV160B

and is the factory-recommended migration path. Please refer to

the

S29AL016D

datasheet for specifications and ordering information. Availability of this document is

retained for reference and historical purposes only.

June 2005

The following document specifies Spansion memory products that are now offered by both Advanced

Micro Devices and Fujitsu. Although the document is marked with the name of the company that

originally developed the specification, these products will be offered to customers of both AMD and

Fujitsu.

Continuity of Specifications

There is no change to this datasheet as a result of offering the device as a Spansion product. Any

changes that have been made are the result of normal datasheet improvement and are noted in the

document revision summary, where supported. Future routine revisions will occur when appro-

priate, and changes will be noted in a revision summary.

For More Information

Please contact your local AMD or Fujitsu sales office for additional information about Spansion

memory solutions.

Publication Number

21358

Revision

Amendment

Issue Date

June 6, 2005

TABLE OF CONTENTS

Distinctive Characteristics . . . . . . . . . . . . . . . . . . . 1

General Description . . . . . . . . . . . . . . . . . . . . . . . . 2

Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 5

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . 6

Special Handling Instructions ................................................... 7

Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 9

Standard Products .................................................................... 9

Device Bus Operations . . . . . . . . . . . . . . . . . . . . . 10

Table 1. Am29LV160B Device Bus Operations .............................. 10

Figure 6. Toggle Bit Algorithm........................................................ 28

DQ3: Sector Erase Timer ....................................................... 29

Table 10. Write Operation Status................................................... 29

Absolute Maximum Ratings . . . . . . . . . . . . . . . . 30

Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . 30

Commercial (C) Devices ......................................................... 30

Industrial (I) Devices ............................................................... 30

Extended (E) Devices ............................................................. 30

Supply Voltages .............................................................. 30

DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 32

CMOS Compatible .................................................................. 32

Zero Power Flash ................................................................... 33

Figure 9. I

CC1

Current vs. Time (Showing Active and Automatic Sleep

Currents) ........................................................................................ 33

Figure 10. Typical I

CC1

vs. Frequency ........................................... 33

Word/Byte Configuration ........................................................ 10

Requirements for Reading Array Data ................................... 10

Writing Commands/Command Sequences ............................ 10

Program and Erase Operation Status .................................... 11

Standby Mode ........................................................................ 11

Automatic Sleep Mode ........................................................... 11

RESET#: Hardware Reset Pin ............................................... 12

Output Disable Mode .............................................................. 12

Table 2. Sector Address Tables (Am29LV160BT).......................... 13

Table 3. Sector Address Tables (Am29LV160BB).......................... 14

Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Figure 11. Test Setup..................................................................... 34

Table 11. Test Specifications ......................................................... 34

Key to Switching Waveforms . . . . . . . . . . . . . . . 34

Figure 12. Input Waveforms and Measurement Levels ................. 34

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 35

Read Operations .................................................................... 35

Figure 13. Read Operations Timings ............................................. 35

Autoselect Mode ..................................................................... 15

Table 4. Am29LV160B Autoselect Codes (High Voltage Method).. 15

Hardware Reset (RESET#) .................................................... 36

Figure 14. RESET# Timings .......................................................... 36

Sector Protection/Unprotection ............................................... 15

Temporary Sector Unprotect .................................................. 16

Figure 1. Temporary Sector Unprotect Operation........................... 16

In-System Sector Protect/Unprotect Algorithms 17

Word/Byte Configuration (BYTE#) ........................................ 37

Figure 15. BYTE# Timings for Read Operations............................ 37

Figure 16. BYTE# Timings for Write Operations............................ 37

Erase/Program Operations ..................................................... 38

Figure 17. Program Operation Timings..........................................

Figure 18. Chip/Sector Erase Operation Timings ..........................

Figure 19. Data# Polling Timings (During Embedded Algorithms).

Figure 20. Toggle Bit Timings (During Embedded Algorithms)......

Figure 21. DQ2 vs. DQ6 for Erase and Erase

Suspend Operations ......................................................................

Common Flash Memory Interface (CFI) . . . . . . . 18

Table 5. CFI Query Identification String .......................................... 18

Table 6. System Interface String..................................................... 19

Table 7. Device Geometry Definition .............................................. 19

Table 8. Primary Vendor-Specific Extended Query ........................ 20

Hardware Data Protection ...................................................... 20

Low V

Write Inhibit .............................................................. 20

Write Pulse “Glitch” Protection ............................................... 20

Logical Inhibit .......................................................................... 20

Power-Up Write Inhibit ............................................................ 20

Command Definitions . . . . . . . . . . . . . . . . . . . . . . 21

Reading Array Data ................................................................ 21

Reset Command ..................................................................... 21

Autoselect Command Sequence ............................................ 21

Word/Byte Program Command Sequence ............................. 21

Unlock Bypass Command Sequence ..................................... 22

Figure 3. Program Operation .......................................................... 22

Temporary Sector Unprotect .................................................. 42

Figure 22. Sector Protect/Unprotect Timing Diagram .................... 43

Alternate CE# Controlled Erase/Program Operations ............ 44

Figure 23. Alternate CE# Controlled Write Operation Timings ...... 45

Chip Erase Command Sequence ........................................... 22

Sector Erase Command Sequence ........................................ 23

Erase Suspend/Erase Resume Commands ........................... 23

Figure 4. Erase Operation............................................................... 24

Table 9. Am29LV160B Command Definitions................................. 25

Write Operation Status . . . . . . . . . . . . . . . . . . . . . 26

DQ7: Data# Polling ................................................................. 26

Figure 5. Data# Polling Algorithm ................................................... 26

RY/BY#: Ready/Busy# ........................................................... 27

DQ6: Toggle Bit I .................................................................... 27

DQ2: Toggle Bit II ................................................................... 27

Reading Toggle Bits DQ6/DQ2 .............................................. 27

Erase and Programming Performance . . . . . . . 46

Latchup Characteristics . . . . . . . . . . . . . . . . . . . 46

TSOP and SO Pin Capacitance . . . . . . . . . . . . . . 46

Data Retention . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 47

TS 048—48-Pin Standard TSOP (measured in millimeters) .. 47

TSR048—48-Pin Reverse TSOP (measured in millimeters) .. 49

FBC048—48-Ball Fine-Pitch Ball Grid Array (FBGA) 8 x 9 mm

(measured in millimeters) ....................................................... 50

SO 044—44-Pin Small Outline Package (measured in millime-

ters) ........................................................................................ 51

Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 52

Revision F (January 1998) ...................................................... 52

Revision F+1 ........................................................................... 52

Revision F+2 ........................................................................... 52

Revision G (January 1999) ..................................................... 52

Revision G+1 (February 1999) ............................................... 52

Revision H (November 23, 1999) ........................................... 52

Revision H+1 (February 22, 2000) ......................................... 53

Am29LV160B

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