16 Mbit (2Mb x8 or 1Mb x16) Low Voltage UV EPROM and OTP EPROM
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | STMicroelectronics |
Parts packaging code | LCC |
package instruction | QCCJ, LDCC44,.7SQ |
Contacts | 44 |
Reach Compliance Code | compli |
ECCN code | EAR99 |
Maximum access time | 100 ns |
Spare memory width | 8 |
I/O type | COMMON |
JESD-30 code | S-PQCC-J44 |
JESD-609 code | e3 |
length | 16.586 mm |
memory density | 16777216 bi |
Memory IC Type | OTP ROM |
memory width | 16 |
Number of functions | 1 |
Number of terminals | 44 |
word count | 1048576 words |
character code | 1000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 1MX16 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | QCCJ |
Encapsulate equivalent code | LDCC44,.7SQ |
Package shape | SQUARE |
Package form | CHIP CARRIER |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 3.3 V |
Certification status | Not Qualified |
Maximum seat height | 4.57 mm |
Maximum standby current | 0.00006 A |
Maximum slew rate | 0.03 mA |
Maximum supply voltage (Vsup) | 3.465 V |
Minimum supply voltage (Vsup) | 3.135 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Matte Tin (Sn) |
Terminal form | J BEND |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 16.586 mm |