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SHF-0589

Description
RF Small Signal Field-Effect Transistor, 1-Element, S Band, Gallium Arsenide, N-Channel, Hetero-junction FET
CategoryDiscrete semiconductor    The transistor   
File Size542KB,8 Pages
ManufacturerQorvo
Websitehttps://www.qorvo.com
Download Datasheet Parametric View All

SHF-0589 Overview

RF Small Signal Field-Effect Transistor, 1-Element, S Band, Gallium Arsenide, N-Channel, Hetero-junction FET

SHF-0589 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
package instructionSMALL OUTLINE, R-PSSO-F3
Contacts3
Reach Compliance Codeunknown
Shell connectionSOURCE
ConfigurationSINGLE
Minimum drain-source breakdown voltage9 V
Maximum drain current (Abs) (ID)0.64 A
FET technologyHETERO-JUNCTION
highest frequency bandS BAND
JESD-30 codeR-PSSO-F3
JESD-609 codee0
Humidity sensitivity level1
Number of components1
Number of terminals3
Operating modeDEPLETION MODE
Maximum operating temperature165 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)235
Polarity/channel typeN-CHANNEL
Maximum power consumption environment2.4 W
Minimum power gain (Gp)10.3 dB
Certification statusNot Qualified
surface mountYES
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formFLAT
Terminal locationSINGLE
Maximum time at peak reflow temperatureNOT SPECIFIED
transistor applicationsSWITCHING
Transistor component materialsGALLIUM ARSENIDE
Base Number Matches1
Preliminary
Preliminary
Product Description
Stanford Microdevices’ SHF-0589 series is a high performance
GaAs Heterostructure FET housed in a low-cost surface-mount
plastic package. HFET technology improves breakdown voltage
while minimizing Schottky leakage current for higher power added
efficiency and improved linearity.
Output power at 1dB compression for the SHF-0589 is +34dBm
when biased for Class AB operation at 8V and 500mA. The
+45 dBm third order intercept makes it ideal for high dynamic
range, high intercept point requirements. They are well suited
for use in both analog and digital wireless communication
infrastructure and subscriber equipment including cellular PCS,
CDPD, wireless data, and pagers.
Adequate heat sinking must be provided for this part to avoid ex-
ceeding the maximum junction temperature. Methods include the
use of screws near the device, and filled vias beneath the part to
the ground plane. Refer to “Mounting and Thermal
Considerations” section on page 7 for more information.
Maximum Available Gain vs. Frequency
Vds = 8.0 volts, Idq = 500 mA
SHF-0589
DC-3 GHz, 2.0 Watt GaAs
HFET
Product Features
Patented GaAs Heterostructure FET
Technology
35
30
25
20
15
10
5
0
0.1
G
max
(dB)
+34 dBm Output Power at 1 dB Compression
+45 dBm Output IP3
High Drain Efficiency: Up to 50% at Class AB
15 dB Gain at 900 MHz (Application circuit)
11 dB Gain at 1900 MHz (Application circuit)
Applications
Analog and Digital Wireless System
Cellular PCS, CDPD, Wireless Data, Pagers
0.8
1.5
2.2
2.9
3.6
4.3
Frequency (GHz)
Electrical Specifications at Ta = 25
°
C
Symbol
Parameters: Test Conditions
Units
Min.
Typ.
Max.
| S
21
|
2
G
max
TOIP
I
Insertion Power Gain
Vds = 8.0V, I dq= 500 mA, Z
S
=Z
L
=50 Ohms
Maximum Available Gain
Vds = 8.0V, I dq= 500 mA, Z
S
=Z
S OPT
, Z
L
=Z
L OPT
Output Third Order Intercept Point
(Device is tuned for maximum power output)
Saturated Drain Current
Vds = 3.0V, Vgs= 0V
Tranconductance:
Vds = 3.0V, Vgs = 0V
Pinch-Off Voltage:
Vds = 2.0V, I d = 2.4 mA
Gate-to-Source Breakdown Voltage, Igs = 4.8mA
Gate-to-Drain Breakdown Voltage, Igd = 4.8mA
Thermal Resistance, junction-to-lead
f = 0.9 GHz
f = 1.9 GHz
f = 0.9 GHz
f = 1.9 GHz
f = 0.9 GHz
f = 1.9 GHz
dB
dB
dBm
dBm
mA
mS
V
V
V
o
15.6
9.4
24
20
46
45
1176
792
-2.7
-1.9
-22
-22
21
-1.0
-17
-17
Dss
G
m
Vp
V
bgs
V
bgd
Rth
C/W
The information provided herein is believed to be reliable at press time. Stanford Microdevices assumes no responsibility for inaccuracies or omissions.
Stanford Microdevices assumes no responsibility for the use of this information, and all such information shall be entirely at the user’s own risk. Prices and specifications are subject to change
without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. Stanford Microdevices does not authorize or warrant any Stanford
Microdevices product for use in life-support devices and/or systems.
Copyright 2000 Stanford Microdevices, Inc. All worldwide rights reserved.
522 Almanor Ave., Sunnyvale, CA 94086
Phone: (800) SMI-MMIC
http://www.stanfordmicro.com
EDS-101242 Rev -B
1

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