Zener Diodes
MAZ7000
Series
(MA7000
Series
)
Silicon planar type
Unit : mm
For stabilization of power supply
φ
0.65 max.
M
ain
Di
sc te
on na
tin nc
ue e/
d
•
Large power dissipation P
tot
(800 mW)
•
Allowing to supply with the radial taping
27 min.
I
Features
Cathode
Colored band indicates
Vz classification
Parameter
Symbol
I
FRM
P
tot
Total power dissipation
*1
800
60
W
W
Non-repetitive reverse surge
power dissipation
*2
Junction temperature
Storage temperature
P
ZSM
T
j
Colored bands indicates type No.
200
°C
°C
T
stg
−55
to
+200
Cathode on the first band (wide)
1 : Cathode
2 : Anode
JEDEC : DO-41
Note) *1 : P
tot
= 800 mW achieved with a printed-circuit board
*2 : t = 100
µs,
T
j
= 150°C
•
Color indication of V
Z
rank classification
A rank
Blue
B rank
Red
ce
/D
Zener voltage
*2
isc
Forward voltage
on
Parameter
tin
Symbol
V
F
R
Z
I
R
S
Z
C
t
ue
I
Common Electrical Characteristics
T
a
= 25°C
*1
Conditions
Min
Typ
Anode
Repetitive peak forward current
V
Z
Operating resistance
Reverse current
Temperature coefficient of zener voltage
*3
Terminal capacitance
Note) 1.
Rated input/output frequency: 5 MHz
2. 1 : The V
Z
value is for the temperature of 25°C. In other cases, carry out the temperature compensation.
*
*2 : Guaranteed at 20 ms after power application.
*3 : T
j
= 25°C to 150°C
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Rating
200
Unit
mA
27 min.
φ
3.0 max.
3rd Band
2nd Band
1st Band
I
Absolute Maximum Ratings
T
a
= 25°C
5.0 max.
Max
1.0
Unit
V
I
F
= 200 mA
I
Z ··················
Specified value
I
Z ··················
Specified value
V
R ···············
Specified value
I
Z ··················
Specified value
V
Ma
int
en
Refer to the list of the
electrical characteristics
within part numbers
an
Ω
µA
pF
mV/°C
V
R ···············
Specified value
Note) The part number in the parenthesis shows conventional part number.
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1)
If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
–
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-
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–
Any applications other than the standard applications intended.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
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damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita
Electric Industrial Co., Ltd.
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