IC,SRAM,32KX8,CMOS,FP,28PIN,CERAMIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
package instruction | DFP, FL28,.25 |
Reach Compliance Code | unknown |
Maximum access time | 70 ns |
I/O type | COMMON |
JESD-30 code | R-XDFP-F28 |
JESD-609 code | e0 |
memory density | 262144 bit |
Memory IC Type | STANDARD SRAM |
memory width | 8 |
Number of terminals | 28 |
word count | 32768 words |
character code | 32000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
organize | 32KX8 |
Output characteristics | 3-STATE |
Package body material | CERAMIC |
encapsulated code | DFP |
Encapsulate equivalent code | FL28,.25 |
Package shape | RECTANGULAR |
Package form | FLATPACK |
Parallel/Serial | PARALLEL |
power supply | 5 V |
Certification status | Not Qualified |
Filter level | 38535Q/M;38534H;883B |
Maximum standby current | 0.02 A |
Minimum standby current | 4.5 V |
Maximum slew rate | 0.11 mA |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | FLAT |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Base Number Matches | 1 |
6206C70/BYAJC | 6206C45/BYAJC | |
---|---|---|
Description | IC,SRAM,32KX8,CMOS,FP,28PIN,CERAMIC | IC,SRAM,32KX8,CMOS,FP,28PIN,CERAMIC |
Is it Rohs certified? | incompatible | incompatible |
package instruction | DFP, FL28,.25 | DFP, FL28,.25 |
Reach Compliance Code | unknown | unknown |
Maximum access time | 70 ns | 45 ns |
I/O type | COMMON | COMMON |
JESD-30 code | R-XDFP-F28 | R-XDFP-F28 |
JESD-609 code | e0 | e0 |
memory density | 262144 bit | 262144 bit |
Memory IC Type | STANDARD SRAM | STANDARD SRAM |
memory width | 8 | 8 |
Number of terminals | 28 | 28 |
word count | 32768 words | 32768 words |
character code | 32000 | 32000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 125 °C | 125 °C |
Minimum operating temperature | -55 °C | -55 °C |
organize | 32KX8 | 32KX8 |
Output characteristics | 3-STATE | 3-STATE |
Package body material | CERAMIC | CERAMIC |
encapsulated code | DFP | DFP |
Encapsulate equivalent code | FL28,.25 | FL28,.25 |
Package shape | RECTANGULAR | RECTANGULAR |
Package form | FLATPACK | FLATPACK |
Parallel/Serial | PARALLEL | PARALLEL |
power supply | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified |
Filter level | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
Maximum standby current | 0.02 A | 0.02 A |
Minimum standby current | 4.5 V | 4.5 V |
Maximum slew rate | 0.11 mA | 0.125 mA |
Nominal supply voltage (Vsup) | 5 V | 5 V |
surface mount | YES | YES |
technology | CMOS | CMOS |
Temperature level | MILITARY | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | FLAT | FLAT |
Terminal pitch | 1.27 mm | 1.27 mm |
Terminal location | DUAL | DUAL |
Base Number Matches | 1 | 1 |