Standard SRAM, 512KX8, 25ns, CMOS, CDFP32, CERAMIC, DFP-32
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
package instruction | CERAMIC, DFP-32 |
Reach Compliance Code | unknown |
Maximum access time | 25 ns |
Other features | TTL COMPATIBLE INPUTS/OUTPUTS |
I/O type | COMMON |
JESD-30 code | R-CDFP-F32 |
memory density | 4194304 bit |
Memory IC Type | STANDARD SRAM |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 32 |
word count | 524288 words |
character code | 512000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 512KX8 |
Output characteristics | 3-STATE |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | DFP |
Encapsulate equivalent code | FL32,.4 |
Package shape | RECTANGULAR |
Package form | FLATPACK |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Certification status | Not Qualified |
Maximum seat height | 2.8448 mm |
Maximum standby current | 0.002 A |
Minimum standby current | 2 V |
Maximum slew rate | 0.225 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal form | FLAT |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 10.7442 mm |
Base Number Matches | 1 |