Microprocessor, 32-Bit, 1333MHz, CMOS, CBGA783, 29 X 29 MM, 1 MM PITCH, CERAMIC, BGA-783
| Parameter Name | Attribute value |
| Parts packaging code | BGA |
| package instruction | BGA, |
| Contacts | 783 |
| Reach Compliance Code | unknown |
| ECCN code | 3A001.A.3 |
| Other features | ALSO REQUIRES 2.5V OR 3.3V SUPPLY |
| Address bus width | 64 |
| bit size | 32 |
| boundary scan | YES |
| maximum clock frequency | 66 MHz |
| External data bus width | 64 |
| Format | FLOATING POINT |
| Integrated cache | YES |
| JESD-30 code | S-CBGA-B783 |
| JESD-609 code | e0 |
| length | 29 mm |
| low power mode | YES |
| Number of terminals | 783 |
| Maximum operating temperature | 110 °C |
| Minimum operating temperature | -40 °C |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | BGA |
| Package shape | SQUARE |
| Package form | GRID ARRAY |
| Certification status | Not Qualified |
| Maximum seat height | 3.38 mm |
| speed | 1333 MHz |
| Maximum supply voltage | 1.155 V |
| Minimum supply voltage | 1.045 V |
| Nominal supply voltage | 1.1 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | TIN LEAD SILVER |
| Terminal form | BALL |
| Terminal pitch | 1 mm |
| Terminal location | BOTTOM |
| width | 29 mm |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR |
| Base Number Matches | 1 |
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