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AE413RAA222GSH

Description
General Purpose Inductor, 2.2uH, 2%, 1 Element, Ceramic-Core, SMD, 1111, CHIP
CategoryPassive components    inductor   
File Size153KB,2 Pages
ManufacturerCOILCRAFT
Websitehttp://www.coilcraft.com/
Download Datasheet Parametric View All

AE413RAA222GSH Overview

General Purpose Inductor, 2.2uH, 2%, 1 Element, Ceramic-Core, SMD, 1111, CHIP

AE413RAA222GSH Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
package instructionCHIP
Reach Compliance Codecompliant
ECCN codeEAR99
uppercase and lowercase codes1111
structureChip
core materialCERAMIC
DC Resistance2.8 Ω
Nominal inductance(L)2.2 µH
Inductor ApplicationsRF INDUCTOR
Inductor typeGENERAL PURPOSE INDUCTOR
JESD-609 codee0
Manufacturer's serial numberAE413RAA
Number of functions1
Number of terminals2
Maximum operating temperature155 °C
Minimum operating temperature-55 °C
Package height2.03 mm
Package length2.92 mm
Package formSMT
Package width2.79 mm
method of packingTR, 7 Inch
Minimum quality factor (at nominal inductance)19
Maximum rated current0.28 A
self resonant frequency150 MHz
seriesAE413RAA
Shape/Size DescriptionRECTANGULAR PACKAGE
shieldNO
special characteristicsQ MEASURED AT 7.9MHZ
surface mountYES
Terminal surfaceTin/Lead (Sn63Pb37)
Terminal locationDUAL ENDED
Terminal shapeWRAPAROUND
Test frequency7.9 MHz
Tolerance2%
Base Number Matches1
1008 CHIP INDUCTORS
Outgassing Compliant Chip Inductors
AE413RAA
High SRF and excellent Q values
Tight tolerances, many values at 1%
39 inductance values from 10 nH to 8.2 µH
Current Derating
120
110
100
90
80
70
60
50
30
20
10
0
40
Typical Q vs Frequency
120
100
100
90
80
100 nH
12 nH
Percent of rated
I
rms
Features high temperature materials that pass NASA low
outgassing specifications and allow operation in ambi-
ent temperatures up to 155°C. The leach-resistant base
metalization with tin-lead (Sn-Pb) terminations ensures
the best possible board adhesion.
47 nH
-40
-20
0
20
25°C
40
60
80
100
120
140 160
Ambient temperature (°C)
Q Factor
70
60
50
40
30
20
10
0
10
100
1000
10000
330 nH
750 nH
1800 nH
A
B
overall
F
G
F
E
terminal
C
I
J
I
H
D
Terminal wraparound:
approx 0.015/0,38 both ends
Frequency (MHz)
Suggested
Land Pattern
Typical L vs Frequency
A max B max
0.115 0.110
2,92
2,79
C max D ref
0.080 0.020
2,03
0,51
E
F
0.080 0.020
2,03 0,51
G
H
I
J
0.060 0.100 0.040 0.050
1,52 2,54 1,02 1,27
Note: Dimensions are before solder application. For maximum overall
dimensions including solder, add 0.0025 in / 0,064 mm to
B
and
0.006 in / 0,15 mm to
A
and
C.
Core material
Ceramic
Terminations
Tin-lead (63/37) over silver-platinum-glass frit
Ambient temperature
–55°C to +125°C with
Imax
current, +125°C
to +155°C with derated current
Storage temperature
Component: –55°C to +155°C.
Tape and reel packaging: –55°C to +80°C
Resistance to soldering heat
Max three 40 second reflows at
+260°C, parts cooled to room temperature between cycles
Temperature Coefficient of Inductance (TCL)
+25 to +155 ppm/°C
Moisture Sensitivity Level (MSL)
1 (unlimited floor life at <30°C /
85% relative humidity)
Enhanced crush-resistant packaging
2000 per 7″ reel
Plastic tape: 8 mm wide, 0.3 mm thick, 4 mm pocket spacing,
2.0 mm pocket depth
®
These parts are preproduction products for electrical evaluation only.
Specification subject to change without notice.
Document AE101-1
Revised 10/20/11
1102 Silver Lake Road
Cary IL 60013
© Coilcraft, Inc. 2011
Phone 800-981-0363
Fax 847-639-1508
E-mail cps@coilcraft.com
Web www.coilcraft-cps.com
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