SY2336-E
1. Features
Colorless transparency lens type
Using a package with high heat dissipation properties,
it can be driven with a large current
Wide viewing angle
Encapsulating Resin : Silicone Resin
External dimensions : 3.5(L)×2.8(W)×1.9mm(T) surface mount type
AUK CORP.
2. Applications
Backlighting
Signal indicator
Symbol backlighting
Front panel indicator
3. Outline Dimensions
unit : mm
2.80± 0.05
2.20± 0.05
1.90± 0.05
0.80± 0.05
0.75± 0.1
1.60± 0.1
3.20± 0.05
2.40± 0.1
1.50± 0.1
0.80± 0.1
2
0.30± 0.1
1.00± 0.1
3.5± 0.1
The contents of this data sheet are subject to change without advance notice for the purpose of improvement.
When using this product, would you please refer to the latest specifications.
)A(100-MDL-KUA
11-GUA-80:etadO.veR
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1
Recommended Soldering Pattern
PIN Connections
1. Anode
2. Cathode
SY2336-E
4. Absolute Maximum Ratings
(Ta=25
o
C)
Characteristic
Power dissipation
Forward current
*1 Peak forward current
Reverse voltage
Operating temperature range
Storage temperature range
*2 Soldering temperature
Symbol
P
D
I
F
I
FP
V
R
T
opr
T
stg
T
sol
-40
-40
Rating
70
30
50
5
100
110
Unit
mW
mA
mA
V
AUK CORP.
*1.Duty ratio = 1/16, Pulse width = 0.1ms
Gradual cooling (Avoid quenching)
240
Preheating area
150~185 , 90±30sec
185
150
Solder area
220 , max. 60sec
25
0
60
The contents of this data sheet are subject to change without advance notice for the purpose of improvement.
When using this product, would you please refer to the latest specifications.
)A(100-MDL-KUA
℃
Time from 25
℃
max. 4
/sec
to Peak Temperature max. 6min
150
180
240
Time (sec)
℃
℃
max. 3
/sec
℃
℃
℃
11-GUA-80:etadO.veR
℃
Temp (
)
Peak Temp max. 240
max. 10sec
℃
*2.Recommended reflow soldering temperature profile
- Preheating 150 to 185 within 120 seconds soldering 240
℃
240
for 10 seconds
within 10 seconds
max. -6
℃
℃
∼
∼
℃
℃
/sec
SY2336-E
5. Electrical / Optical Characteristics
(Ta=25
o
C)
Characteristic
Forward voltage
*3 Luminous intensity
Dominant wavelength
Spectrum bandwidth
Reverse current
*4 Half angle
Symbol
V
F
I
V
AUK CORP.
Test Condition
I
F
= 20mA
I
F
= 20mA
I
F
= 20mA
I
F
= 20mA
V
R
=5V
I
F
= 20mA
Min
1.95
120
585
-
-
-
Typ
-
-
591
17
-
±60
Max
2.4
280
595
-
10
-
Unit
V
mcd
nm
nm
µA
deg
λ
D
∆
λ
I
R
θ
/2
*3.The test result of I
F
=20mA is only for reference
*4.
θ
/2
is the off-axis angle where the luminous intensity is
1/2
the peak intensity
Test Condition @ I
F
=20mA
Forward Voltage [V]
Luminous Intensity
[mcd]
Dominant Wavelength
[nm]
a: 585~587
1: 1.95~2.2
L: 120~175
b: 587~589
M1: 175~205
2: 2.2~2.4
M2: 205~240
M3: 240~280
c: 589~591
d: 591~593
e: 593~595
(Each V
F
, I
V
,
λ
D
range did not consider a margin. Please refer to ±0.1V of V
F
range,
±18% of I
V
range, ±1nm of
λ
D
range as a permitted limit and do not use to combine
grade classification. It must be used separately grade classification)
The contents of this data sheet are subject to change without advance notice for the purpose of improvement.
When using this product, would you please refer to the latest specifications.
)A(100-MDL-KUA
℃
I
V
/ V
F
/
λ
D
Grade Classification (Ta=25 )
11-GUA-80:etadO.veR
◆
SY2336-E
Precaution for handling Silicone Resin LED
•
The encapsulated resin of the LEDs is silicone. So LEDs have a soft surface on the top of the package. The
pressure to the top surface will be influence to the reliability of the LEDs. Precaution should be taken to avoid the
strong pressure on the encapsulated part.
AUK CORP.
•
Housings using a silicone resin attract dust more compared to standard encapsulation.
It is recommended that a suitable cleaning solution must be applied to the surface after soldering.
1. Handling indications
1) When users handle the SMT LEDs, mechanical stress on the surface should be minimized as much as
possible. Sharp objects of all types should not be used to pierce the sealing compound.
2) LED should only be handled from the side.
Silicone resin is softer than generally used Epoxy resin.
3) When users operate the chip lifter, the picking up nozzle which does not affect the soft surface should be used.
This is assured by choosing the picking up nozzle which is larger than the LED reflecting area.
2. Cleaning indication
1) It is strongly recommended that isopropyl alcohol be used as a solvent. When using other solvents, it should be
confirmed beforehand whether the solvents will dissolve the package and the resin or not. Freon solvents should
not be used to clean the LEDs because of worldwide regulations.
2) Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on
the LEDs depends on factors such as ultrasonic power and the assembled condition.
Before cleaning, a pre- test should be done to confirm whether any damage to the LEDs will occur.
The contents of this data sheet are subject to change without advance notice for the purpose of improvement.
When using this product, would you please refer to the latest specifications.
)A(100-MDL-KUA
11-GUA-80:etadO.veR
SY2336-E
6. Characteristic Diagrams
Fig. 2 I
V
- I
F
Fig. 1 I
F
- V
F
Luminous Intensity I
v
[mcd]
AUK CORP.
Forward
Current I
F
[mA]
Forward
Voltage V
F
[V]
Forward
Current I
F
[mA]
Fig. 3 I
F
– Ta
Fig.4 Spectrum Distribution
Current I
F
[mA]
Forward
Ambient Temperature Ta [
℃
]
Relative Intensity [%]
Wavelength
λ
[nm]
Fig. 5 Radiation Diagram
Relative Luminous Intensity Iv [%]
The contents of this data sheet are subject to change without advance notice for the purpose of improvement.
When using this product, would you please refer to the latest specifications.
)A(100-MDL-KUA
001
05
0
05
001
11-GUA-80:etadO.veR
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