Bonding wire is a core material for semiconductor packaging. It is a part that connects pins and silicon wafers and transmits electrical signals. It is an indispensable core material in semiconductor ...
[align=left][font=微软雅黑][size=4][color=rgb(34, 34, 34)]Robots have now been developed into many different applications, such as service robots, driverless cars, and industrial robots. As the types and ...
See the attached source code for demonstrating AT32F4xx using UCOS III
Supported models: AT32F403xx, AT32F403Axx, AT32F407xx, AT32F413xx, AT32F415xx, AT32F421xxMain peripherals: USART1
1 Quick Use Ins...
Tyzx, a US company that develops 3D measurement technology, recently announced that it has received technology development investment from Takata, a company that develops collision avoidance sensors f...
Small base stations help 5G connections
In 5G wireless networks, the use of small base stations and distributed antenna systems (DAS) can achieve higher data capacity while improving the quality of se...