IC SPECIALTY TELECOM CIRCUIT, UUC, FLIP CHIP PACKAGE, Telecom IC:Other
Parameter Name | Attribute value |
Maker | NXP |
Parts packaging code | FLIP-CHIP |
package instruction | DIE, |
Reach Compliance Code | unknown |
JESD-30 code | X-XUUC-N |
Number of functions | 1 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -25 °C |
Package body material | UNSPECIFIED |
encapsulated code | DIE |
Package shape | UNSPECIFIED |
Package form | UNCASED CHIP |
Certification status | Not Qualified |
surface mount | YES |
Telecom integrated circuit types | TELECOM CIRCUIT |
Temperature level | OTHER |
Terminal form | NO LEAD |
Terminal location | UPPER |
Base Number Matches | 1 |