Cache SRAM, 256KX18, 10ns, CMOS, PBGA119, BGA-119
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | GSI Technology |
Parts packaging code | BGA |
package instruction | BGA, |
Contacts | 119 |
Reach Compliance Code | unknown |
ECCN code | 3A991.B.2.B |
Maximum access time | 10 ns |
Other features | FLOW-THROUGH OR PIPELINED ARCHITECTURE |
JESD-30 code | R-PBGA-B119 |
JESD-609 code | e1 |
length | 22 mm |
memory density | 4718592 bit |
Memory IC Type | CACHE SRAM |
memory width | 18 |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of terminals | 119 |
word count | 262144 words |
character code | 256000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 256KX18 |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Package shape | RECTANGULAR |
Package form | GRID ARRAY |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 260 |
Certification status | Not Qualified |
Maximum seat height | 2.4 mm |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 3.135 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | TIN SILVER COPPER |
Terminal form | BALL |
Terminal pitch | 1.27 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 14 mm |
Base Number Matches | 1 |