ZBT SRAM, 256KX18, 9ns, CMOS, PQFP100, PLASTIC, MS-026BHA, TQFP-100
Parameter Name | Attribute value |
Parts packaging code | QFP |
package instruction | LQFP, |
Contacts | 100 |
Reach Compliance Code | unknown |
ECCN code | 3A991.B.2.A |
Maximum access time | 9 ns |
JESD-30 code | R-PQFP-G100 |
length | 20 mm |
memory density | 4718592 bit |
Memory IC Type | ZBT SRAM |
memory width | 18 |
Number of functions | 1 |
Number of terminals | 100 |
word count | 262144 words |
character code | 256000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 256KX18 |
Package body material | PLASTIC/EPOXY |
encapsulated code | LQFP |
Package shape | RECTANGULAR |
Package form | FLATPACK, LOW PROFILE |
Parallel/Serial | PARALLEL |
Certification status | Not Qualified |
Maximum seat height | 1.6 mm |
Maximum supply voltage (Vsup) | 3.465 V |
Minimum supply voltage (Vsup) | 3.135 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal form | GULL WING |
Terminal pitch | 0.65 mm |
Terminal location | QUAD |
width | 14 mm |
Base Number Matches | 1 |
MT55L256L18F1T-12IT | MT55L128V36F1T-10IT | |
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Description | ZBT SRAM, 256KX18, 9ns, CMOS, PQFP100, PLASTIC, MS-026BHA, TQFP-100 | ZBT SRAM, 128KX36, 7.5ns, CMOS, PQFP100, PLASTIC, MS-026BHA, TQFP-100 |
Parts packaging code | QFP | QFP |
package instruction | LQFP, | LQFP, |
Contacts | 100 | 100 |
Reach Compliance Code | unknown | unknown |
ECCN code | 3A991.B.2.A | 3A991.B.2.A |
Maximum access time | 9 ns | 7.5 ns |
JESD-30 code | R-PQFP-G100 | R-PQFP-G100 |
length | 20 mm | 20 mm |
memory density | 4718592 bit | 4718592 bit |
Memory IC Type | ZBT SRAM | ZBT SRAM |
memory width | 18 | 36 |
Number of functions | 1 | 1 |
Number of terminals | 100 | 100 |
word count | 262144 words | 131072 words |
character code | 256000 | 128000 |
Operating mode | SYNCHRONOUS | SYNCHRONOUS |
Maximum operating temperature | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | -40 °C |
organize | 256KX18 | 128KX36 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | LQFP | LQFP |
Package shape | RECTANGULAR | RECTANGULAR |
Package form | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE |
Parallel/Serial | PARALLEL | PARALLEL |
Certification status | Not Qualified | Not Qualified |
Maximum seat height | 1.6 mm | 1.6 mm |
Maximum supply voltage (Vsup) | 3.465 V | 3.465 V |
Minimum supply voltage (Vsup) | 3.135 V | 3.135 V |
Nominal supply voltage (Vsup) | 3.3 V | 3.3 V |
surface mount | YES | YES |
technology | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL |
Terminal form | GULL WING | GULL WING |
Terminal pitch | 0.65 mm | 0.65 mm |
Terminal location | QUAD | QUAD |
width | 14 mm | 14 mm |
Base Number Matches | 1 | 1 |