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MT55L256L18F1T-12IT

Description
ZBT SRAM, 256KX18, 9ns, CMOS, PQFP100, PLASTIC, MS-026BHA, TQFP-100
Categorystorage    storage   
File Size491KB,31 Pages
ManufacturerCypress Semiconductor
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MT55L256L18F1T-12IT Overview

ZBT SRAM, 256KX18, 9ns, CMOS, PQFP100, PLASTIC, MS-026BHA, TQFP-100

MT55L256L18F1T-12IT Parametric

Parameter NameAttribute value
Parts packaging codeQFP
package instructionLQFP,
Contacts100
Reach Compliance Codeunknown
ECCN code3A991.B.2.A
Maximum access time9 ns
JESD-30 codeR-PQFP-G100
length20 mm
memory density4718592 bit
Memory IC TypeZBT SRAM
memory width18
Number of functions1
Number of terminals100
word count262144 words
character code256000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize256KX18
Package body materialPLASTIC/EPOXY
encapsulated codeLQFP
Package shapeRECTANGULAR
Package formFLATPACK, LOW PROFILE
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height1.6 mm
Maximum supply voltage (Vsup)3.465 V
Minimum supply voltage (Vsup)3.135 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationQUAD
width14 mm
Base Number Matches1

MT55L256L18F1T-12IT Related Products

MT55L256L18F1T-12IT MT55L128V36F1T-10IT
Description ZBT SRAM, 256KX18, 9ns, CMOS, PQFP100, PLASTIC, MS-026BHA, TQFP-100 ZBT SRAM, 128KX36, 7.5ns, CMOS, PQFP100, PLASTIC, MS-026BHA, TQFP-100
Parts packaging code QFP QFP
package instruction LQFP, LQFP,
Contacts 100 100
Reach Compliance Code unknown unknown
ECCN code 3A991.B.2.A 3A991.B.2.A
Maximum access time 9 ns 7.5 ns
JESD-30 code R-PQFP-G100 R-PQFP-G100
length 20 mm 20 mm
memory density 4718592 bit 4718592 bit
Memory IC Type ZBT SRAM ZBT SRAM
memory width 18 36
Number of functions 1 1
Number of terminals 100 100
word count 262144 words 131072 words
character code 256000 128000
Operating mode SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C
organize 256KX18 128KX36
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LQFP LQFP
Package shape RECTANGULAR RECTANGULAR
Package form FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Certification status Not Qualified Not Qualified
Maximum seat height 1.6 mm 1.6 mm
Maximum supply voltage (Vsup) 3.465 V 3.465 V
Minimum supply voltage (Vsup) 3.135 V 3.135 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V
surface mount YES YES
technology CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL
Terminal form GULL WING GULL WING
Terminal pitch 0.65 mm 0.65 mm
Terminal location QUAD QUAD
width 14 mm 14 mm
Base Number Matches 1 1

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