UPD17134ACT-XXX datasheet, PDF - EEWORLD Datasheet

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UPD17134ACT-XXX: Description4-BIT, MROM, 2MHz, MICROCONTROLLER, PDIP28, 0.400 INCH, PLASTIC, SDIP-28; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，294 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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UPD17134ACT-XXX Overview

4-BIT, MROM, 2MHz, MICROCONTROLLER, PDIP28, 0.400 INCH, PLASTIC, SDIP-28

UPD17134ACT-XXX Parametric

Parameter Name	Attribute value
Parts packaging code	DIP
package instruction	DIP, SDIP28,.4
Contacts	28
Reach Compliance Code	unknown
Has ADC	YES
Address bus width
bit size	4
CPU series	UPD17K
maximum clock frequency	2 MHz
DAC channel	NO
DMA channel	NO
External data bus width	8
JESD-30 code	R-PDIP-T28
Number of I/O lines	21
Number of terminals	28
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	NO
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	SDIP28,.4
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	3/5 V
Certification status	Not Qualified
RAM (bytes)	56
rom(word)	1024
ROM programmability	MROM
speed	2 MHz
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	THROUGH-HOLE
Terminal pitch	1.78 mm
Terminal location	DUAL
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER
Base Number Matches	1

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To our customers,

Old Company Name in Catalogs and Other Documents

On April 1

st

, 2010, NEC Electronics Corporation merged with Renesas Technology

Corporation, and Renesas

Electronics Corporation

took over all the business of both

companies.

Therefore, although the old company name remains in this document, it is a valid

Renesas

Electronics document. We appreciate your understanding.

Renesas Electronics website: http://www.renesas.com

April 1

st

, 2010

Renesas Electronics Corporation

Issued by:

Renesas Electronics Corporation

(http://www.renesas.com)

Send any inquiries to http://www.renesas.com/inquiry.

Notice

1.

All information included in this document is current as of the date this document is issued. Such information, however, is

subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please

confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to

additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website.

Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights

of third parties by or arising from the use of Renesas Electronics products or technical information described in this document.

No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights

of Renesas Electronics or others.

You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part.

Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of

semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software,

and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by

you or third parties arising from the use of these circuits, software, or information.

When exporting the products or technology described in this document, you should comply with the applicable export control

laws and regulations and follow the procedures required by such laws and regulations. You should not use Renesas

Electronics products or the technology described in this document for any purpose relating to military applications or use by

the military, including but not limited to the development of weapons of mass destruction. Renesas Electronics products and

technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited

under any applicable domestic or foreign laws or regulations.

Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics

does not warrant that such information is error free. Renesas Electronics assumes no liability whatsoever for any damages

incurred by you resulting from errors in or omissions from the information included herein.

Renesas Electronics products are classified according to the following three quality grades: “Standard”, “High Quality”, and

“Specific”. The recommended applications for each Renesas Electronics product depends on the product’s quality grade, as

indicated below. You must check the quality grade of each Renesas Electronics product before using it in a particular

application. You may not use any Renesas Electronics product for any application categorized as “Specific” without the prior

written consent of Renesas Electronics. Further, you may not use any Renesas Electronics product for any application for

which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way

liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an

application categorized as “Specific” or for which the product is not intended where you have failed to obtain the prior written

consent of Renesas Electronics. The quality grade of each Renesas Electronics product is “Standard” unless otherwise

expressly specified in a Renesas Electronics data sheets or data books, etc.

Computers; office equipment; communications equipment; test and measurement equipment; audio and visual

equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots.

“High Quality”: Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anti-

crime systems; safety equipment; and medical equipment not specifically designed for life support.

“Specific”:

Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or

systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare

intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life.

You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics,

especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation

characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or

damages arising out of the use of Renesas Electronics products beyond such specified ranges.

Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have

specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further,

Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to

guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a

Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire

control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because

the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system

manufactured by you.

Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental

compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable

laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS

Directive. Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with

applicable laws and regulations.

This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas

Electronics.

Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this

document or Renesas Electronics products, or if you have any other inquiries.

“Standard”:

2.

3.

4.

5.

6.

7.

8.

9.

10.

11.

12.

(Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majority-

owned subsidiaries.

(Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.

NOTES FOR CMOS DEVICES

1

PRECAUTION AGAINST ESD FOR SEMICONDUCTORS

Note:

Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and

ultimately degrade the device operation. Steps must be taken to stop generation of static electricity

as much as possible, and quickly dissipate it once, when it has occurred. Environmental control

must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using

insulators that easily build static electricity. Semiconductor devices must be stored and transported

in an anti-static container, static shielding bag or conductive material. All test and measurement

tools including work bench and floor should be grounded. The operator should be grounded using

wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions

need to be taken for PW boards with semiconductor devices on it.

2

HANDLING OF UNUSED INPUT PINS FOR CMOS

Note:

No connection for CMOS device inputs can be cause of malfunction. If no connection is provided

to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence

causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input

levels of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each

unused pin should be connected to V

DD

or GND with a resistor, if it is considered to have a

possibility of being an output pin. All handling related to the unused pins must be judged device

by device and related specifications governing the devices.

3

STATUS BEFORE INITIALIZATION OF MOS DEVICES

Note:

Power-on does not necessarily define initial status of MOS device. Production process of MOS

does not define the initial operation status of the device. Immediately after the power source is

turned ON, the devices with reset function have not yet been initialized. Hence, power-on does

not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until

the reset signal is received. Reset operation must be executed immediately after power-on for

devices having reset function.

UPD17134ACT-XXX Related Products

	UPD17134ACT-XXX	UPD17137AGT-XXX	UPD17134AGT-XXX	UPD17137ACT-XXX	UPD17136AGT-XXX	UPD17135AGT-XXX	UPD17136ACT-XXX
Description	4-BIT, MROM, 2MHz, MICROCONTROLLER, PDIP28, 0.400 INCH, PLASTIC, SDIP-28	4-BIT, MROM, 8MHz, MICROCONTROLLER, PDSO28, 0.375 INCH, PLASTIC, SOP-28	4-BIT, MROM, 2MHz, MICROCONTROLLER, PDSO28, 0.375 INCH, PLASTIC, SOP-28	4-BIT, MROM, 8MHz, MICROCONTROLLER, PDIP28, 0.400 INCH, PLASTIC, SDIP-28	4-BIT, MROM, 2MHz, MICROCONTROLLER, PDSO28, 0.375 INCH, PLASTIC, SOP-28	4-BIT, MROM, 8MHz, MICROCONTROLLER, PDSO28, 0.375 INCH, PLASTIC, SOP-28	4-BIT, MROM, 2MHz, MICROCONTROLLER, PDIP28, 0.400 INCH, PLASTIC, SDIP-28
Parts packaging code	DIP	SOIC	SOIC	DIP	SOIC	SOIC	DIP
package instruction	DIP, SDIP28,.4	SOP, SOP28,.4	SOP, SOP28,.4	DIP, SDIP28,.4	SOP, SOP28,.4	SOP, SOP28,.4	DIP, SDIP28,.4
Contacts	28	28	28	28	28	28	28
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Has ADC	YES	YES	YES	YES	YES	YES	YES
bit size	4	4	4	4	4	4	4
CPU series	UPD17K	UPD17K	UPD17K	UPD17K	UPD17K	UPD17K	UPD17K
maximum clock frequency	2 MHz	8 MHz	2 MHz	8 MHz	2 MHz	8 MHz	2 MHz
DAC channel	NO	NO	NO	NO	NO	NO	NO
DMA channel	NO	NO	NO	NO	NO	NO	NO
External data bus width	8	8	8	8	8	8	8
JESD-30 code	R-PDIP-T28	R-PDSO-G28	R-PDSO-G28	R-PDIP-T28	R-PDSO-G28	R-PDSO-G28	R-PDIP-T28
Number of I/O lines	21	21	21	21	21	21	21
Number of terminals	28	28	28	28	28	28	28
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
PWM channel	NO	NO	NO	NO	NO	NO	NO
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	SOP	SOP	DIP	SOP	SOP	DIP
Encapsulate equivalent code	SDIP28,.4	SOP28,.4	SOP28,.4	SDIP28,.4	SOP28,.4	SOP28,.4	SDIP28,.4
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE
power supply	3/5 V	3/5 V	3/5 V	3/5 V	3/5 V	3/5 V	3/5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM (bytes)	56	56	56	56	56	56	56
rom(word)	1024	2048	1024	2048	2048	1024	2048
ROM programmability	MROM	MROM	MROM	MROM	MROM	MROM	MROM
speed	2 MHz	8 MHz	2 MHz	8 MHz	2 MHz	8 MHz	2 MHz
Maximum supply voltage	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	YES	NO	YES	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	THROUGH-HOLE	GULL WING	GULL WING	THROUGH-HOLE	GULL WING	GULL WING	THROUGH-HOLE
Terminal pitch	1.78 mm	1.27 mm	1.27 mm	1.78 mm	1.27 mm	1.27 mm	1.78 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER
Maker	-	-	-	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation

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