74SC541P datasheet, PDF - EEWORLD Datasheet

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74SC541P: DescriptionIC,BUFFER/DRIVER,SINGLE,8-BIT,SC-CMOS,DIP,20PIN,PLASTIC; Categorylogic logic; File Size209KB，4 Pages; ManufacturerMicrochip; Websitehttps://www.microchip.com

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74SC541P Overview

IC,BUFFER/DRIVER,SINGLE,8-BIT,SC-CMOS,DIP,20PIN,PLASTIC

74SC541P Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	DIP, DIP20,.3
Reach Compliance Code	not_compliant
Control type	ENABLE LOW
JESD-30 code	R-PDIP-T20
JESD-609 code	e0
Logic integrated circuit type	BUS DRIVER
MaximumI(ol)	0.012 A
Number of digits	8
Number of functions	1
Number of terminals	20
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Output characteristics	3-STATE
Output polarity	TRUE
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP20,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
Base Number Matches	1

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Description	IC,BUFFER/DRIVER,SINGLE,8-BIT,SC-CMOS,DIP,20PIN,PLASTIC	IC,BUFFER/DRIVER,DUAL,4-BIT,SC-CMOS,DIP,20PIN,CERAMIC	IC,BUFFER/DRIVER,DUAL,4-BIT,SC-CMOS,DIP,20PIN,CERAMIC	IC,BUFFER/DRIVER,DUAL,4-BIT,SC-CMOS,DIP,20PIN,PLASTIC	IC,BUFFER/DRIVER,SINGLE,8-BIT,SC-CMOS,DIP,20PIN,CERAMIC	IC,BUFFER/DRIVER,DUAL,4-BIT,SC-CMOS,DIP,20PIN,CERAMIC	IC,BUFFER/DRIVER,DUAL,4-BIT,SC-CMOS,DIP,20PIN,PLASTIC	IC,BUFFER/DRIVER,DUAL,4-BIT,SC-CMOS,DIP,20PIN,CERAMIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Reach Compliance Code	not_compliant	compliant	compliant	compliant	not_compliant	compliant	compliant	compliant
Control type	ENABLE LOW	ENABLE LOW/HIGH	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW/HIGH
JESD-30 code	R-PDIP-T20	R-XDIP-T20	R-XDIP-T20	R-PDIP-T20	R-XDIP-T20	R-XDIP-T20	R-PDIP-T20	R-XDIP-T20
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0
Logic integrated circuit type	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER
MaximumI(ol)	0.012 A	0.012 A	0.012 A	0.012 A	0.012 A	0.012 A	0.012 A	0.012 A
Number of digits	8	4	4	4	8	4	4	4
Number of functions	1	2	2	2	1	2	2	2
Number of terminals	20	20	20	20	20	20	20	20
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Output polarity	TRUE	TRUE	TRUE	TRUE	TRUE	INVERTED	INVERTED	TRUE
Package body material	PLASTIC/EPOXY	CERAMIC	CERAMIC	PLASTIC/EPOXY	CERAMIC	CERAMIC	PLASTIC/EPOXY	CERAMIC
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP20,.3	DIP20,.3	DIP20,.3	DIP20,.3	DIP20,.3	DIP20,.3	DIP20,.3	DIP20,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	NO	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
package instruction	DIP, DIP20,.3	DIP, DIP20,.3	DIP, DIP20,.3	DIP, DIP20,.3	DIP, DIP20,.3	-	-	DIP, DIP20,.3
Base Number Matches	1	1	1	1	1	-	-	-

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