TSI850-D133CLZ datasheet, PDF - EEWORLD Datasheet

TSI850-D133CLZ: DescriptionPCI Bus Controller, CMOS, PBGA676, 27 X 27 MM, 1 MM PITCH, HSBGA-676; CategoryThe embedded processor and controller Microcontrollers and processors; File Size6MB，688 Pages; ManufacturerTundra Semiconductor Corp

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TSI850-D133CLZ Overview

PCI Bus Controller, CMOS, PBGA676, 27 X 27 MM, 1 MM PITCH, HSBGA-676

Parameter Name	Attribute value
package instruction	27 X 27 MM, 1 MM PITCH, HSBGA-676
Reach Compliance Code	unknown
Address bus width	32
maximum clock frequency	133 MHz
External data bus width	64
JESD-30 code	S-PBGA-B676
length	27 mm
Number of terminals	676
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Package shape	SQUARE
Package form	GRID ARRAY
Certification status	Not Qualified
Maximum seat height	2.36 mm
Maximum supply voltage	1.89 V
Minimum supply voltage	1.71 V
Nominal supply voltage	1.8 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
width	27 mm
uPs/uCs/peripheral integrated circuit type	BUS CONTROLLER, PCI
Base Number Matches	1

TitlePage - 8A9000_MA001_03

Tsi85x

™

PowerPC Host Bridge

User Manual

Document Number: 8A9000_MA001_03

Document Status: Advance

Release Date: March 2002

This document discusses the features, capabilities, and

configuration requirements of the Tsi85x. It is intended for hardware

and software engineers who are designing system interconnect

applications with the Tsi85x.

Tundra Semiconductor Corporation

	TSI850-D133CLZ	TSI854-D133ILZ
Description	PCI Bus Controller, CMOS, PBGA676, 27 X 27 MM, 1 MM PITCH, HSBGA-676	PCI Bus Controller, CMOS, PBGA772, 31 X 31 MM, 1 MM PITCH, HSBGA-772
package instruction	27 X 27 MM, 1 MM PITCH, HSBGA-676	31 X 31 MM, 1 MM PITCH, HSBGA-772
Reach Compliance Code	unknown	unknown
Address bus width	32	32
maximum clock frequency	133 MHz	133 MHz
External data bus width	64	64
JESD-30 code	S-PBGA-B676	S-PBGA-B772
length	27 mm	31 mm
Number of terminals	676	772
Maximum operating temperature	70 °C	85 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA
Package shape	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY
Certification status	Not Qualified	Not Qualified
Maximum seat height	2.36 mm	2.26 mm
Maximum supply voltage	1.89 V	1.89 V
Minimum supply voltage	1.71 V	1.71 V
Nominal supply voltage	1.8 V	1.8 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	COMMERCIAL	INDUSTRIAL
Terminal form	BALL	BALL
Terminal pitch	1 mm	1 mm
Terminal location	BOTTOM	BOTTOM
width	27 mm	31 mm
uPs/uCs/peripheral integrated circuit type	BUS CONTROLLER, PCI	BUS CONTROLLER, PCI

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