|
25LC040A |
25LC040AT-H/SN |
25LC040A-H/SN |
25LC020A-H/SN |
25LC010A_09 |
25LC020A |
25LC010A |
Description |
512 X 8 SPI BUS SERIAL EEPROM, PDSO8 |
512 X 8 SPI BUS SERIAL EEPROM, PDSO8 |
512 X 8 SPI BUS SERIAL EEPROM, PDSO8 |
512 X 8 SPI BUS SERIAL EEPROM, PDSO8 |
512 X 8 SPI BUS SERIAL EEPROM, PDSO8 |
512 X 8 SPI BUS SERIAL EEPROM, PDSO8 |
512 X 8 SPI BUS SERIAL EEPROM, PDSO8 |
Number of functions |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
Number of terminals |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
Maximum operating temperature |
150 Cel |
150 °C |
150 °C |
150 °C |
150 Cel |
150 Cel |
150 Cel |
Minimum operating temperature |
-40 Cel |
-40 °C |
-40 °C |
-40 °C |
-40 Cel |
-40 Cel |
-40 Cel |
surface mount |
Yes |
YES |
YES |
YES |
Yes |
Yes |
Yes |
Terminal form |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
Temperature level |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
memory width |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
organize |
512 X 8 |
512X8 |
512X8 |
256X8 |
512 X 8 |
512 X 8 |
512 X 8 |
Maximum supply/operating voltage |
5.5 V |
- |
- |
- |
5.5 V |
5.5 V |
5.5 V |
Minimum supply/operating voltage |
2.5 V |
- |
- |
- |
2.5 V |
2.5 V |
2.5 V |
Rated supply voltage |
5 V |
- |
- |
- |
5 V |
5 V |
5 V |
maximum clock frequency |
5 MHz |
- |
- |
- |
5 MHz |
5 MHz |
5 MHz |
Processing package description |
3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 |
- |
- |
- |
3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 |
3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 |
3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 |
Lead-free |
Yes |
- |
- |
- |
Yes |
Yes |
Yes |
EU RoHS regulations |
Yes |
- |
- |
- |
Yes |
Yes |
Yes |
China RoHS regulations |
Yes |
- |
- |
- |
Yes |
Yes |
Yes |
state |
ACTIVE |
- |
- |
- |
ACTIVE |
ACTIVE |
ACTIVE |
Craftsmanship |
CMOS |
- |
- |
- |
CMOS |
CMOS |
CMOS |
packaging shape |
RECTANGULAR |
- |
- |
- |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package Size |
SMALL OUTLINE |
- |
- |
- |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE |
Terminal spacing |
1.27 mm |
- |
- |
- |
1.27 mm |
1.27 mm |
1.27 mm |
terminal coating |
MATTE TIN |
- |
- |
- |
MATTE TIN |
MATTE TIN |
MATTE TIN |
Packaging Materials |
PLASTIC/EPOXY |
- |
- |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
storage density |
4096 deg |
- |
- |
- |
4096 deg |
4096 deg |
4096 deg |
operating mode |
SYNCHRONOUS |
- |
- |
- |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
Number of digits |
512 |
- |
- |
- |
512 |
512 |
512 |
Memory IC type |
SPI BUS SERIAL EEPROM |
- |
- |
- |
SPI BUS SERIAL EEPROM |
SPI BUS SERIAL EEPROM |
SPI BUS SERIAL EEPROM |
serial parallel |
SERIAL |
- |
- |
- |
SERIAL |
SERIAL |
SERIAL |
Maximum TWC of write cycle |
6 ms |
- |
- |
- |
6 ms |
6 ms |
6 ms |