XR1004-BD
Receiver
30.0-46.0 GHz
Features
Sub-harmonic Receiver
Integrated LNA, LO Doubler/Buffer,
Image Reject Mixer
+4.0 dBm Input Third Order Intercept (IIP3)
+2.0 dBm LO Drive Level
9.0 dB Conversion Gain
3.5 dB Noise Figure
18.0 dB Image Rejection
100% On-Wafer RF, DC & Noise Figure Testing
100% Commercial-Level Visual Inspection Using
Mil-Std-883 Method 2010
RoHS* Compliant and 260°C Reflow Compatible
Rev. V1
Chip Device Layout
Absolute Maximum Ratings
Parameter
Absolute Max.
+6.0 VDC
110,180 mA
+0.3 VDC
+5 dBm
-65 ºC to +165 ºC
-55 ºC to Table
1
MTTF Table
1
Supply Voltage (Vd)
Supply Current (Id1,2), (Id3)
Gate Bias Voltage (Vg)
Input Power (RF Pin)
Storage Temperature (Tstg)
Operating Temperature (Ta)
Channel Temperature (Tch)
(1)
Description
M/A-COM Tech’s 30.0-46.0 GHz GaAs MMIC
receiver has a noise figure of 3.5 dB and 18.0 dB
image rejection across the band. This device is a
three stage LNA followed by an image reject
resistive pHEMT mixer and includes an integrated
LO doubler and LO buffer amplifer. The image reject
mixer eliminates the need for a bandpass filter after
the LNA to remove thermal noise at the image
frequency. The use of integrated LO doubler and LO
buffer amplifier makes the provision of the LO easier
than for fundamental mixers at these frequencies. I
and Q mixer outputs are provided and an external
90 degree hybrid is required to select the desired
sideband. This MMIC uses M/A-COM Tech’s GaAs
PHEMT device model technology, and is based
upon electron beam lithography to ensure high
repeatability and uniformity. The chip has surface
passivation to protect and provide a rugged part with
backside via holes and gold metallization to allow
either a conductive epoxy or eutectic solder die
attach process. This device is well suited for
Millimeter-wave Point-to-Point Radio, LMDS,
SATCOM and VSAT applications.
Channel temperature affects a device's MTTF. It is recommended to
keep channel temperature as low as possible for maximum life.
Ordering Information
Part Number
XR1004-BD-000V
XR1004-BD-EV1
Package
Where “V” is RoHS compli-
ant die packed in vacuum
released gel paks
evaluation module
1
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
•
India
Tel: +91.80.43537383
•
China
Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
XR1004-BD
Receiver
30.0-46.0 GHz
Rev. V1
Electrical Specifications: 35-46 GHz
(RF/Upper Side Band)
(Ambient Temperature T=25°C)
Parameter
Frequency Range (RF) Lower Side Band
Frequency Range (LO)
Frequency Range (IF)
Input Return Loss RF (S11)
Small Signal Conversion Gain RF/IF (S21)
2
LO Input Drive (P
LO
)
Image Rejection
2
Noise Figure (NF)
2
Isolation LO/RF @ LOx1/LOx2
Input Third Order Intercept (IIP3)
1,2
Drain Bias Voltage (Vd1,2,3)
Gate Bias Voltage (Vg1,2,3)
Gate Bias Voltage (Vg4,5) Mixer, Doubler
Supply Current (Id1,2) (Vd1,2=4.0 V, Vg=-0.3 V Typical)
Supply Current (Id3) (Vd3=4.0 V, Vg=-0.3 V Typical)
(1)
(2)
Measured using constant current.
Measured using LO Input drive level of 0.0 and +2.0 dBm.
Units
GHz
GHz
GHz
dB
dB
dBm
dBc
dB
dB
dBm
VDC
VDC
VDC
mA
mA
Min.
30.0
15.5
DC
-
9.0
-
15.0
-
-
-
-
-1.2
-1.2
-
-
Typ.
-
-
-
10.0
9.0
+2.0
18.0
3.5
40.0/40.0
+4.0
+4.0
-0.3
-0.5
50
145
Max.
46.0
25.0
4.0
-
-
-
-
4.0
-
-
+5.5
+0.1
+0.1
100
165
Block Diagram & Schematics
2
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
•
India
Tel: +91.80.43537383
•
China
Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
XR1004-BD
Receiver
30.0-46.0 GHz
Typical Performance Curves
Rev. V1
3
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
•
India
Tel: +91.80.43537383
•
China
Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
XR1004-BD
Receiver
30.0-46.0 GHz
Mechanical Drawing
1.170
(0.046)
1.571
(0.062)
1.871
(0.074)
2.470
(0.097)
Rev. V1
1.620
(0.064)
2
3
4
5
6
0.646
(0.025)
0.298
(0.012)
1
0.0
12
11
10
9
8
7
0.0
1.170
(0.046)
1.571
(0.062)
1.871
(0.074)
2.271
(0.089)
2.671
(0.105)
3.071
(0.121)
3.970
(0.156)
(Note: Engineering designator is 40REC0452)
Units:millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness:0.110 +/- 0.010 (0.0043 +/- 0.0004),Backside is ground,Bond Pad/Backside Metallization:Gold
All DC/IFBond Pads are 0.100 x 0.100 (0.004 x 0.004).All RFBond Pads are 0.100 x 0.200 (0.004 x 0.008)
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance:+/- 0.005 (+/- 0.0002).Approximate weight:3.987 mg.
Bond Pad #1 (RFIn)
Bond Pad #2 (Vd1)
Bond Pad #3 (Vd2)
Bond Pad #4 (IF1)
Bond Pad #5 (Vd3)
Bond Pad #6 (LO)
Bond Pad #7 (Vg5)
Bond Pad #8 (Vg3)
Bond Pad #9 (Vg4)
Bond Pad #10 (IF2)
Bond Pad #11 (Vg2)
Bond Pad #12 (Vg1)
Bias Arrangement
Vd2
Vd3
Bypass Capacitors - See App Note [2]
Vd1,2
Vd3
IF1
Vd1
IF1
2
3
4
5
XR1004-BD
RF
6
LO
Vg5
RF Out
RF
1
12
11
10
9
8
7
IF2
Vg1
Vg2
Vg4
Vg3
Vg5
IF2
Vg1,2
Vg4
Vg3
4
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
•
India
Tel: +91.80.43537383
•
China
Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
XR1004-BD
Receiver
30.0-46.0 GHz
MTTF Table (TBD)
These numbers were calculated based on accelerated life test information and thermal model analysis received from the fabricating
foundry.
Rev. V1
Backplate
Temperature
55 deg Celsius
Channel
Temperature
deg Celsius
Rth
C/W
MTTF Hours
E+
FITs
E+
75 deg Celsius
95 deg Celsius
deg Celsius
deg Celsius
C/W
C/W
E+
E+
E+
E+
Bias Conditions: Vd1=Vd2=Vd3=4.0V,Id1=Id2=25 mA,Id3=145 mA
5
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
•
India
Tel: +91.80.43537383
•
China
Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
京公网安备 11010802033920号
EEWORLD
