200100N • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • June 2, 2014
1
DATA SHEET • CLA SERIES DIODES
Table 1. CLA Series Absolute Maximum Ratings
Parameter
Power dissipation
Symbol
P
DIS
Minimum
Typical
Maximum
Maximum T
J
Case Temp
Thermal Re sis tan ce
junction
to
case
Units
W
Reverse voltage
Forward current
Junction temperature
Storage temperature
Electrostatic discharge:
Charged Device Model (CDM), Class 4
Human Body Model (HBM), Class 1C
Machine Model (MM), Class A
Note:
V
R
I
F
T
J
T
STG
–65
–65
Minimum rated breakdown voltage
200
+175
+200
V
mA
C
C
1000
1000
150
V
V
V
Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.
CAUTION:
Although this device is designed to be as robust as possible, electrostatic discharge (ESD) can damage this device. This device
must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body
or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times.
Table 2. CLA Series Electrical Specifications (Notes 1 and 2)
Breakdown
Voltage (V)
I Region
(μm)
Junction
Capacitance
(C
J
) @ 0 V
(pF)
Typical
0.12
0.20
0.20
0.12
0.20
0.20
0.20
0.60
0.26
0.13
Junction
Capacitance
(C
J
) @ 6 V
(pF)
Maximum
0.10
0.15
0.15
0.10
0.15
0.15
0.15 @ 50 V
0.50 @ 50 V
0.14
0.12
Thermal Resistance (θ) (Note 3)
Minority Carrier
Series
Resistance (R
S
) Lifetime (T
L
) @ Average
Input Power
1
μs
Pulse
@ 10 mA
10 mA
(W)
(C/W) 0.1% Duty Cycle
(Ω)
(ns)
(C/W)
Maximum
2.5
2.0
2.0
2.5
2.0
2.0
2.0
1.2
1.5
2.2
Typical
5
5
5
7
7
10
50
100
1175
20
Maximum
47
59
45
64
53
54
91
123
52
72
Typical
47
59
45
64
53
54
91
123
52
72
Typical
2.0
1.7
2.1
1.7
1.6
1.6
1.0
1.1
2.9
1.3
Part Number
Min to Max
CLA4601-000
CLA4602-000
CLA4603-000
CLA4604-000
CLA4605-000
CLA4606-000
CLA4607-000
CLA4608-000
CLA4609-000
CLA4610-000
15 to 30
15 to 30
20 to 45
30 to 60
30 to 60
45 to 75
120 to 180
120 to 180
250 (Min.)
80 to 120
Nominal
1
1
1.5
2.0
2.0
2.5
7.0
7.0
20
4.5
Note 1:
Performance is guaranteed only under the conditions listed in this table and is not guaranteed over the full operating or storage temperature ranges. Operation at
elevated temperatures may reduce reliability of the device.
Note 2:
T
OP
= +25
C,
C
J
measured at 1 MHz, R
S
measured at 500 MHz, CW thermal resistance for infinite heat sink, unless otherwise noted.
Note 3:
Thermal resistance is calculated from the measured power dissipation @ f = 2.6 GHz, T
June 2, 2014 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 200100N
DATA SHEET • CLA SERIES DIODES
Table 3. Typical Performance @ 25
°C
@ 2.6 GHz, Z
0
= 50 Ω (Note 1)
CW Input Power
for 1 dB
Insertion Loss
(dBm)
12
12
10
11
12
14
26
26
37
24
Maximum CW
Input Power
(dBm)
36
36
38
40
40
41
43
43
44
40
Maximum
Pulsed Input
Power
(dBm) (Note 2)
65
65
67
70
70
71
73
73
74
57
Output @
Maximum
Pulsed Input
(dBm) (Note 2)
21
24
22
24
27
27
39
44
50
32
Part Number
CLA4601-000
CLA4602-000
CLA4603-000
CLA4604-000
CLA4605-000
CLA4606-000
CLA4607-000
CLA4608-000
CLA4609-000
CLA4610-000
Insertion Loss
@ –10 dBm (dB)
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.2
0.3
0.1
Recovery Time
(ns) (Note 3)
5
5
5
5
5
5
5
5
5
5
Spike Leakage
(ergs) (Note 4)
Note 5
Note 5
Note 5
Note 5
0.08
0.03
0.21
0.15
25.77
Note 5
Note 1:
Diode chip is mounted on a 0.5 oz Cu PC board using 1 to 2 mils of conductive epoxy. Bond wire connections are made with 0.8 mil Au wire. Limiter configured with shunt connected
diode and 22 nH ground return and 100 pF DC blocking capacitors.
Note 2:
Pulsed power measurements taken at 1 μs pulse width, @ f = 10 KHz, and 0.1% duty cycle.
Note 3:
Recovery time represents the transition time from the high-loss state to the low-loss state following the removal of a high-power input. It is defined as the time from the end of the
high-power pulse to the time when insertion loss has returned to within 3 dB of the quiescent (low-power) state.
Note 4:
Spike Leakage (ergs) = t
s
x P
s
x 10
7
where t
s
is the spike width at the half-power point (in seconds) and P
S
is the maximum spike amplitude in watts.
Note 5:
Not detectable under current test conditions described in Note 2.
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