Standard SRAM, 256KX32, 3.5ns, CMOS, PBGA119, CSP, FBGA-119
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | ALSC [Alliance Semiconductor Corporation] |
| Parts packaging code | BGA |
| package instruction | BGA, BGA119(UNSPEC) |
| Contacts | 119 |
| Reach Compliance Code | unknown |
| ECCN code | 3A991.B.2.A |
| Maximum access time | 3.5 ns |
| I/O type | COMMON |
| JESD-30 code | R-PBGA-B119 |
| JESD-609 code | e0 |
| memory density | 8388608 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 32 |
| Number of functions | 1 |
| Number of terminals | 119 |
| word count | 262144 words |
| character code | 256000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 256KX32 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | BGA |
| Encapsulate equivalent code | BGA119(UNSPEC) |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 3.3 V |
| Certification status | Not Qualified |
| Maximum standby current | 0.005 A |
| Minimum standby current | 3 V |
| Maximum slew rate | 0.35 mA |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 3 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | BALL |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| Base Number Matches | 1 |
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