Microcontroller, 8-Bit, MROM, 8051 CPU, 16MHz, CMOS, PQFP80,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Philips Semiconductors (NXP Semiconductors N.V.) |
| package instruction | QFP, QFP80,.7X.9,32 |
| Reach Compliance Code | unknown |
| bit size | 8 |
| CPU series | 8051 |
| JESD-30 code | R-PQFP-G80 |
| JESD-609 code | e0 |
| Number of terminals | 80 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QFP |
| Encapsulate equivalent code | QFP80,.7X.9,32 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| power supply | 5 V |
| Certification status | Not Qualified |
| RAM (bytes) | 256 |
| rom(word) | 8192 |
| ROM programmability | MROM |
| speed | 16 MHz |
| Maximum slew rate | 45 mA |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 0.8 mm |
| Terminal location | QUAD |
| Base Number Matches | 1 |
| PCF83C552-5H/XXX | PCF83C552-5WP/XXX | PCB83C552-5WP/XXX | PCA83C552-5WP/XXX | PCA83C552-5H/XXX | PCB83C552-5H/XXX | |
|---|---|---|---|---|---|---|
| Description | Microcontroller, 8-Bit, MROM, 8051 CPU, 16MHz, CMOS, PQFP80, | Microcontroller, 8-Bit, MROM, 8051 CPU, 16MHz, CMOS, PQCC68, | Microcontroller, 8-Bit, MROM, 8051 CPU, 16MHz, CMOS, PQCC68, | Microcontroller, 8-Bit, MROM, 8051 CPU, 16MHz, CMOS, PQCC68, | Microcontroller, 8-Bit, MROM, 8051 CPU, 16MHz, CMOS, PQFP80, | Microcontroller, 8-Bit, MROM, 8051 CPU, 16MHz, CMOS, PQFP80, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
| package instruction | QFP, QFP80,.7X.9,32 | QCCJ, LDCC68,1.0SQ | QCCJ, LDCC68,1.0SQ | QCCJ, LDCC68,1.0SQ | QFP, QFP80,.7X.9,32 | QFP, QFP80,.7X.9,32 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknow |
| bit size | 8 | 8 | 8 | 8 | 8 | 8 |
| CPU series | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 |
| JESD-30 code | R-PQFP-G80 | S-PQCC-J68 | S-PQCC-J68 | S-PQCC-J68 | R-PQFP-G80 | R-PQFP-G80 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| Number of terminals | 80 | 68 | 68 | 68 | 80 | 80 |
| Maximum operating temperature | 85 °C | 85 °C | 70 °C | 125 °C | 125 °C | 70 °C |
| Minimum operating temperature | -40 °C | -40 °C | - | -40 °C | -40 °C | - |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | QFP | QCCJ | QCCJ | QCCJ | QFP | QFP |
| Encapsulate equivalent code | QFP80,.7X.9,32 | LDCC68,1.0SQ | LDCC68,1.0SQ | LDCC68,1.0SQ | QFP80,.7X.9,32 | QFP80,.7X.9,32 |
| Package shape | RECTANGULAR | SQUARE | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR |
| Package form | FLATPACK | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | FLATPACK | FLATPACK |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM (bytes) | 256 | 256 | 256 | 256 | 256 | 256 |
| rom(word) | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 |
| ROM programmability | MROM | MROM | MROM | MROM | MROM | MROM |
| speed | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz |
| Maximum slew rate | 45 mA | 45 mA | 45 mA | 40 mA | 40 mA | 45 mA |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | AUTOMOTIVE | AUTOMOTIVE | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | J BEND | J BEND | J BEND | GULL WING | GULL WING |
| Terminal pitch | 0.8 mm | 1.27 mm | 1.27 mm | 1.27 mm | 0.8 mm | 0.8 mm |
| Terminal location | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
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