Quad 2-Input NAND Gate
Parameter Name | Attribute value |
Brand Name | Fairchild Semiconduc |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | Fairchild |
Parts packaging code | TSSOP |
package instruction | TSSOP, TSSOP14,.25 |
Contacts | 14 |
Manufacturer packaging code | 14 LD,TSSOP,JEDEC MO-153, 4.4MM WIDE |
Reach Compliance Code | compli |
ECCN code | EAR99 |
series | AHCT/VHCT |
JESD-30 code | R-PDSO-G14 |
JESD-609 code | e4 |
length | 5 mm |
Load capacitance (CL) | 50 pF |
Logic integrated circuit type | NAND GATE |
MaximumI(ol) | 0.008 A |
Humidity sensitivity level | 1 |
Number of functions | 4 |
Number of entries | 2 |
Number of terminals | 14 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | TSSOP |
Encapsulate equivalent code | TSSOP14,.25 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
method of packing | RAIL |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 5 V |
Prop。Delay @ Nom-Su | 9 ns |
propagation delay (tpd) | 9 ns |
Certification status | Not Qualified |
Schmitt trigger | NO |
Maximum seat height | 1.2 mm |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Nickel/Palladium/Gold (Ni/Pd/Au) |
Terminal form | GULL WING |
Terminal pitch | 0.65 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 30 |
width | 4.4 mm |
Base Number Matches | 1 |
74VHCT00AMTC | 74VHCT00A | 74VHCT00AN | 74VHCT00AMTCX_NL | 74VHCT00AN_NL | |
---|---|---|---|---|---|
Description | Quad 2-Input NAND Gate | Quad 2-Input NAND Gate | Quad 2-Input NAND Gate | Quad 2-Input NAND Gate | Quad 2-Input NAND Gate |
Is it Rohs certified? | conform to | - | conform to | conform to | conform to |
Maker | Fairchild | - | Fairchild | Fairchild | Fairchild |
Parts packaging code | TSSOP | - | DIP | TSSOP | DIP |
package instruction | TSSOP, TSSOP14,.25 | - | DIP, DIP14,.3 | TSSOP, TSSOP14,.25 | DIP, DIP14,.3 |
Contacts | 14 | - | 14 | 14 | 14 |
Reach Compliance Code | compli | - | compli | compli | compli |
series | AHCT/VHCT | - | AHCT/VHCT | AHCT/VHCT | AHCT/VHCT |
JESD-30 code | R-PDSO-G14 | - | R-PDIP-T14 | R-PDSO-G14 | R-PDIP-T14 |
length | 5 mm | - | 19.18 mm | 5 mm | 19.18 mm |
Load capacitance (CL) | 50 pF | - | 50 pF | 50 pF | 50 pF |
Logic integrated circuit type | NAND GATE | - | NAND GATE | NAND GATE | NAND GATE |
MaximumI(ol) | 0.008 A | - | 0.008 A | 0.008 A | 0.008 A |
Number of functions | 4 | - | 4 | 4 | 4 |
Number of entries | 2 | - | 2 | 2 | 2 |
Number of terminals | 14 | - | 14 | 14 | 14 |
Maximum operating temperature | 85 °C | - | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | - | -40 °C | -40 °C | -40 °C |
Package body material | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | TSSOP | - | DIP | TSSOP | DIP |
Encapsulate equivalent code | TSSOP14,.25 | - | DIP14,.3 | TSSOP14,.25 | DIP14,.3 |
Package shape | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE |
method of packing | RAIL | - | RAIL | TAPE AND REEL | RAIL |
Peak Reflow Temperature (Celsius) | 260 | - | NOT SPECIFIED | 260 | NOT SPECIFIED |
power supply | 5 V | - | 5 V | 5 V | 5 V |
Prop。Delay @ Nom-Su | 9 ns | - | 9 ns | 9 ns | 9 ns |
propagation delay (tpd) | 9 ns | - | 9 ns | 9 ns | 9 ns |
Certification status | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
Schmitt trigger | NO | - | NO | NO | NO |
Maximum seat height | 1.2 mm | - | 5.08 mm | 1.2 mm | 5.08 mm |
Maximum supply voltage (Vsup) | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | - | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | - | 5 V | 5 V | 5 V |
surface mount | YES | - | NO | YES | NO |
technology | CMOS | - | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal form | GULL WING | - | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
Terminal pitch | 0.65 mm | - | 2.54 mm | 0.65 mm | 2.54 mm |
Terminal location | DUAL | - | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | 30 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | 4.4 mm | - | 7.62 mm | 4.4 mm | 7.62 mm |