EEWORLDEEWORLDEEWORLD

Part Number

Search

MPC750ARX333RH

Description
RISC Microprocessor, 32-Bit, 333MHz, CMOS, CBGA255, CERAMIC, BGA-255
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size64KB,8 Pages
ManufacturerMotorola ( NXP )
Websitehttps://www.nxp.com
Download Datasheet Parametric Compare View All

MPC750ARX333RH Overview

RISC Microprocessor, 32-Bit, 333MHz, CMOS, CBGA255, CERAMIC, BGA-255

MPC750ARX333RH Parametric

Parameter NameAttribute value
package instructionBGA,
Reach Compliance Codeunknown
Address bus width32
bit size32
boundary scanNO
External data bus width64
FormatFLOATING POINT
Integrated cacheYES
JESD-30 codeS-CBGA-B255
low power modeYES
Number of terminals255
Maximum operating temperature105 °C
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeBGA
Package shapeSQUARE
Package formGRID ARRAY
Certification statusNot Qualified
speed333 MHz
Nominal supply voltage1.9 V
surface mountYES
technologyCMOS
Terminal formBALL
Terminal locationBOTTOM
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR, RISC
Base Number Matches1
Application Note
AN1794/D
Rev. 0.1, 11/2001
Backside L2 Timing Analysis
for PCB Design Engineers
Bruce Parker
risc10
@email.sps.mot.com
The backside L2 interfaces on the MPC750 and the G4 processors dramatically increase their
performance. Since the L2 design basically connects the processor’s L2 controller to the
memory SRAMs, the main task for the board designer is to determine what board propagation
delays will provide sufficient setup and hold margins for a given target frequency. This
document discusses how to determine the propagation delay restrictions for the backside L2
interface of processors that implement the PowerPC architecture and a method for optimizing
the setup and hold margins by using clock offsets.
Setup and hold margins are controlled partially by the processor and memory timing
specifications, and partially by the PCB propagation and skew characteristics. Using the
various timing specifications from the processor and memory data sheets, one can calculate
the minimum and maximum propagation delay allowable. Once these delays are known for all
cycle types (that is, address, data write, and data read cycles) one can optimize the setup and
hold margins by adding delay to either the processor’s L2 feedback clock or to the memory’s
clock. Once an offset, if any, is calculated, the final allowable propagation delays can be
converted to length restrictions for use by the PCB layout designer.
The following definitions are used during the analysis:
t
co_src
—Time from the rising edge of the clock until the output becomes valid;
specified by the source of the output signal
t
oh_src
—Time from the rising edge of the clock until the output becomes invalid;
specified by the source of the output signal
t
su_rcvr
—Time that an input must be valid before the rising edge of the clock;
specified by the receiver of the signal
t
ih_rcvr
—Time that an input must remain valid after the rising edge of the clock;
specified by the receiver of the signal
t
jitter
—Clock jitter from L2 clock source (cycle-to-cycle)
t
cksk
—Clock skew introduced from PCB routing and clock loading differences; this
includes unintentional length mismatches, skew from PCB impedance differences,
and skew due to clock loading differences.
t
per
—Clock period of L2 interface
t
prop
—Time for a signal to propagate from a driver’s output to a receiver’s input
t
ckoffset
—An intentional offset between the L2 controller’s feedback clock and the
memory’s clock. This offset is calculated later in this document.

MPC750ARX333RH Related Products

MPC750ARX333RH MPC750ARX300RH MPC750ARX200TH
Description RISC Microprocessor, 32-Bit, 333MHz, CMOS, CBGA255, CERAMIC, BGA-255 RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA255, CERAMIC, BGA-255 RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, CERAMIC, BGA-255
package instruction BGA, BGA, BGA, BGA360,19X19,50
Reach Compliance Code unknown unknown unknown
Address bus width 32 32 32
bit size 32 32 32
boundary scan NO NO NO
External data bus width 64 64 64
Format FLOATING POINT FLOATING POINT FLOATING POINT
Integrated cache YES YES YES
JESD-30 code S-CBGA-B255 S-CBGA-B255 S-CBGA-B255
low power mode YES YES YES
Number of terminals 255 255 255
Maximum operating temperature 105 °C 105 °C 105 °C
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
encapsulated code BGA BGA BGA
Package shape SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY
Certification status Not Qualified Not Qualified Not Qualified
speed 333 MHz 300 MHz 200 MHz
Nominal supply voltage 1.9 V 1.9 V 2.6 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Terminal form BALL BALL BALL
Terminal location BOTTOM BOTTOM BOTTOM
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1 -
Maker - Motorola ( NXP ) Motorola ( NXP )

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号