|
74HC4851BQ |
74HCT4851 |
74HC4851 |
74HCT4851PW |
74HCT4851D |
74HCT4851BQ |
Description |
SGL ENDED MULTIPLEXER, PDSO16 |
SGL ENDED MULTIPLEXER, PDSO16 |
SGL ENDED MULTIPLEXER, PDSO16 |
SGL ENDED MULTIPLEXER, PDSO16 |
SGL ENDED MULTIPLEXER, PDSO16 |
SGL ENDED MULTIPLEXER, PDSO16 |
Number of terminals |
16 |
16 |
16 |
16 |
16 |
16 |
surface mount |
YES |
Yes |
Yes |
YES |
YES |
YES |
Terminal form |
NO LEAD |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
NO LEAD |
Terminal location |
QUAD |
pair |
pair |
DUAL |
DUAL |
QUAD |
Is it Rohs certified? |
conform to |
- |
- |
conform to |
conform to |
conform to |
Maker |
NXP |
- |
- |
NXP |
NXP |
NXP |
Parts packaging code |
QFN |
- |
- |
TSSOP |
SOIC |
QFN |
package instruction |
2.50 X 3.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT763-1, DHVQFN-16 |
- |
- |
TSSOP-16 |
SOP-16 |
DHVQFN-16 |
Contacts |
16 |
- |
- |
16 |
16 |
16 |
Reach Compliance Code |
compliant |
- |
- |
compliant |
compliant |
compliant |
Analog Integrated Circuits - Other Types |
SINGLE-ENDED MULTIPLEXER |
- |
- |
SINGLE-ENDED MULTIPLEXER |
SINGLE-ENDED MULTIPLEXER |
SINGLE-ENDED MULTIPLEXER |
JESD-30 code |
R-PQCC-N16 |
- |
- |
R-PDSO-G16 |
R-PDSO-G16 |
R-PQCC-N16 |
length |
3.5 mm |
- |
- |
5 mm |
9.9 mm |
3.5 mm |
Humidity sensitivity level |
1 |
- |
- |
1 |
1 |
1 |
Number of channels |
8 |
- |
- |
8 |
8 |
8 |
Number of functions |
1 |
- |
- |
1 |
1 |
1 |
On-state resistance matching specifications |
8 Ω |
- |
- |
2 Ω |
2 Ω |
2 Ω |
Maximum on-state resistance (Ron) |
330 Ω |
- |
- |
210 Ω |
210 Ω |
210 Ω |
Maximum operating temperature |
125 °C |
- |
- |
125 °C |
125 °C |
125 °C |
Minimum operating temperature |
-40 °C |
- |
- |
-40 °C |
-40 °C |
-40 °C |
Package body material |
PLASTIC/EPOXY |
- |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
HVQCCN |
- |
- |
TSSOP |
SOP |
HVQCCN |
Encapsulate equivalent code |
LCC16,.1X.14,20 |
- |
- |
TSSOP16,.25 |
SOP16,.25 |
LCC16,.1X.14,20 |
Package shape |
RECTANGULAR |
- |
- |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
- |
- |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
Peak Reflow Temperature (Celsius) |
260 |
- |
- |
260 |
260 |
260 |
power supply |
2/6 V |
- |
- |
5 V |
5 V |
5 V |
Certification status |
Not Qualified |
- |
- |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
1 mm |
- |
- |
1.1 mm |
1.75 mm |
1 mm |
Maximum signal current |
0.05 A |
- |
- |
0.05 A |
0.05 A |
0.05 A |
Maximum supply current (Isup) |
0.002 mA |
- |
- |
0.02 mA |
0.02 mA |
0.02 mA |
Maximum supply voltage (Vsup) |
6 V |
- |
- |
5.5 V |
5.5 V |
5.5 V |
Minimum supply voltage (Vsup) |
2 V |
- |
- |
4.5 V |
4.5 V |
4.5 V |
Nominal supply voltage (Vsup) |
3 V |
- |
- |
5 V |
5 V |
5 V |
technology |
CMOS |
- |
- |
CMOS |
CMOS |
CMOS |
Temperature level |
AUTOMOTIVE |
- |
- |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
Terminal pitch |
0.5 mm |
- |
- |
0.65 mm |
1.27 mm |
0.5 mm |
Maximum time at peak reflow temperature |
30 |
- |
- |
30 |
30 |
30 |
width |
2.5 mm |
- |
- |
4.4 mm |
3.9 mm |
2.5 mm |
Base Number Matches |
1 |
- |
- |
1 |
1 |
1 |