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SN54LS55JD

Description
AND-OR-Invert Gate, LS Series, 1-Func, 8-Input, TTL, CDIP14, CERAMIC, DIP-14
Categorylogic    logic   
File Size29KB,1 Pages
ManufacturerMotorola ( NXP )
Websitehttps://www.nxp.com
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SN54LS55JD Overview

AND-OR-Invert Gate, LS Series, 1-Func, 8-Input, TTL, CDIP14, CERAMIC, DIP-14

SN54LS55JD Parametric

Parameter NameAttribute value
package instructionDIP,
Reach Compliance Codeunknown
Other featuresEXPANDABLE
seriesLS
JESD-30 codeR-GDIP-T14
length19.495 mm
Load capacitance (CL)15 pF
Logic integrated circuit typeAND-OR-INVERT GATE
Number of functions1
Number of entries8
Number of terminals14
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
Maximum supply current (ICC)1.3 mA
propagation delay (tpd)20 ns
Certification statusNot Qualified
Maximum seat height5.08 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyTTL
Temperature levelMILITARY
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
width7.62 mm
Base Number Matches1

SN54LS55JD Related Products

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Description AND-OR-Invert Gate, LS Series, 1-Func, 8-Input, TTL, CDIP14, CERAMIC, DIP-14 LS SERIES, 8-INPUT AND-OR-INVERT GATE, CDIP14, CERAMIC, DIP-14 LS SERIES, 8-INPUT AND-OR-INVERT GATE, CDIP14, CERAMIC, DIP-14 LS SERIES, 8-INPUT AND-OR-INVERT GATE, PDIP14, PLASTIC, DIP-14
package instruction DIP, DIP, DIP14,.3 DIP, DIP14,.3 DIP, DIP14,.3
Reach Compliance Code unknown unknown unknown unknown
Other features EXPANDABLE EXPANDABLE EXPANDABLE EXPANDABLE
series LS LS LS LS
JESD-30 code R-GDIP-T14 R-GDIP-T14 R-GDIP-T14 R-PDIP-T14
length 19.495 mm 19.495 mm 19.495 mm 18.86 mm
Load capacitance (CL) 15 pF 15 pF 15 pF 15 pF
Logic integrated circuit type AND-OR-INVERT GATE AND-OR-INVERT GATE AND-OR-INVERT GATE AND-OR-INVERT GATE
Number of functions 1 1 1 1
Number of entries 8 8 8 8
Number of terminals 14 14 14 14
Maximum operating temperature 125 °C 70 °C 70 °C 70 °C
Package body material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED PLASTIC/EPOXY
encapsulated code DIP DIP DIP DIP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE
Maximum supply current (ICC) 1.3 mA 1.3 mA 1.3 mA 1.3 mA
propagation delay (tpd) 20 ns 20 ns 20 ns 20 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 5.08 mm 5.08 mm 5.08 mm 4.69 mm
Maximum supply voltage (Vsup) 5.5 V 5.25 V 5.25 V 5.25 V
Minimum supply voltage (Vsup) 4.5 V 4.75 V 4.75 V 4.75 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V
surface mount NO NO NO NO
technology TTL TTL TTL TTL
Temperature level MILITARY COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL
width 7.62 mm 7.62 mm 7.62 mm 7.62 mm
Base Number Matches 1 1 1 -
Parts packaging code - DIP DIP DIP
Contacts - 14 14 14
JESD-609 code - e0 e0 e0
Encapsulate equivalent code - DIP14,.3 DIP14,.3 DIP14,.3
Peak Reflow Temperature (Celsius) - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply - 5 V 5 V 5 V
Schmitt trigger - NO NO NO
Terminal surface - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Maximum time at peak reflow temperature - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
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