FIFO, 16KX9, 30ns, Asynchronous, CMOS, DIE
Parameter Name | Attribute value |
package instruction | DIE |
Reach Compliance Code | unknown |
Maximum access time | 30 ns |
period time | 40 ns |
JESD-30 code | X-XUUC-N |
memory density | 147456 bit |
memory width | 9 |
Number of functions | 1 |
word count | 16384 words |
character code | 16000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
organize | 16KX9 |
Exportable | NO |
Package body material | UNSPECIFIED |
Package shape | UNSPECIFIED |
Package form | UNCASED CHIP |
Parallel/Serial | PARALLEL |
Certification status | Not Qualified |
Filter level | MIL-STD-883 Class B |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | MILITARY |
Terminal form | NO LEAD |
Terminal location | UPPER |
Base Number Matches | 1 |
MM0-67206FV-30/883 | SM0-67206FV-15SB | SM0-67206FV-15/883 | SM0-67206FV-15 | SM0-67206FV-15SC | MM0-67206FV-15/883 | SM0-67206FV-30 | MM0-67206FV-15 | |
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Description | FIFO, 16KX9, 30ns, Asynchronous, CMOS, DIE | FIFO, 16KX9, 15ns, Asynchronous, CMOS, DIE | FIFO, 16KX9, 15ns, Asynchronous, CMOS, DIE | FIFO, 16KX9, 15ns, Asynchronous, CMOS, DIE | FIFO, 16KX9, 15ns, Asynchronous, CMOS, DIE | FIFO, 16KX9, 15ns, Asynchronous, CMOS, DIE | FIFO, 16KX9, 30ns, Asynchronous, CMOS, DIE | FIFO, 16KX9, 15ns, Asynchronous, CMOS, DIE |
package instruction | DIE | DIE | DIE | DIE | DIE | DIE | DIE | DIE |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
Maximum access time | 30 ns | 15 ns | 15 ns | 15 ns | 15 ns | 15 ns | 30 ns | 15 ns |
period time | 40 ns | 25 ns | 25 ns | 25 ns | 25 ns | 25 ns | 40 ns | 25 ns |
JESD-30 code | X-XUUC-N | X-XUUC-N | X-XUUC-N | X-XUUC-N | X-XUUC-N | X-XUUC-N | X-XUUC-N | X-XUUC-N |
memory density | 147456 bit | 147456 bit | 147456 bit | 147456 bit | 147456 bit | 147456 bit | 147456 bit | 147456 bit |
memory width | 9 | 9 | 9 | 9 | 9 | 9 | 9 | 9 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
word count | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words |
character code | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
organize | 16KX9 | 16KX9 | 16KX9 | 16KX9 | 16KX9 | 16KX9 | 16KX9 | 16KX9 |
Exportable | NO | NO | NO | NO | NO | NO | NO | NO |
Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
Package shape | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
Package form | UNCASED CHIP | UNCASED CHIP | UNCASED CHIP | UNCASED CHIP | UNCASED CHIP | UNCASED CHIP | UNCASED CHIP | UNCASED CHIP |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | YES | YES | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
Terminal form | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
Terminal location | UPPER | UPPER | UPPER | UPPER | UPPER | UPPER | UPPER | UPPER |
Maker | - | TEMIC | TEMIC | TEMIC | TEMIC | TEMIC | TEMIC | TEMIC |