N74S301F datasheet, PDF - EEWORLD Datasheet

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N74S301F: DescriptionStandard SRAM, 256X1, 50ns, TTL, CDIP16; Categorystorage storage; File Size199KB，4 Pages; ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.); Websitehttps://www.nxp.com/

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N74S301F Overview

Standard SRAM, 256X1, 50ns, TTL, CDIP16

N74S301F Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Philips Semiconductors (NXP Semiconductors N.V.)
package instruction	DIP, DIP16,.3
Reach Compliance Code	unknown
Is Samacsys	N
Maximum access time	50 ns
JESD-30 code	R-XDIP-T16
JESD-609 code	e0
Memory IC Type	STANDARD SRAM
memory width	1
Number of terminals	16
word count	256 words
character code	256
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256X1
Output characteristics	OPEN-COLLECTOR
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Not Qualified
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	TTL
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

N74S301F Related Products

	N74S301F	N74S301FA	N74S301FB	S54S301F/883B	S54S301F/883C	N74S301D	N74S301N-B	N74S301N	N74LS301N
Description	Standard SRAM, 256X1, 50ns, TTL, CDIP16	Standard SRAM, 256X1, 50ns, TTL, CDIP16	Standard SRAM, 256X1, 50ns, TTL, CDIP16,	Standard SRAM, 256X1, 70ns, TTL, CDIP16	Standard SRAM, 256X1, 70ns, TTL, CDIP16,	Standard SRAM, 256X1, 50ns, TTL, PDSO16	Standard SRAM, 256X1, 50ns, TTL, PDIP16	Standard SRAM, 256X1, 50ns, TTL, PDIP16	Standard SRAM, 256X1, 40ns, TTL, PDIP16,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	SOP, SOP16,.4	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Maximum access time	50 ns	50 ns	50 ns	70 ns	70 ns	50 ns	50 ns	50 ns	40 ns
JESD-30 code	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16	R-PDSO-G16	R-PDIP-T16	R-PDIP-T16	R-PDIP-T16
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	1	1	1	1	1	1	1	1	1
Number of terminals	16	16	16	16	16	16	16	16	16
word count	256 words	256 words	256 words	256 words	256 words	256 words	256 words	256 words	256 words
character code	256	256	256	256	256	256	256	256	256
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	125 °C	125 °C	70 °C	70 °C	70 °C	70 °C
organize	256X1	256X1	256X1	256X1	256X1	256X1	256X1	256X1	256X1
Output characteristics	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP	DIP	SOP	DIP	DIP	DIP
Encapsulate equivalent code	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	SOP16,.4	DIP16,.3	DIP16,.3	DIP16,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	SMALL OUTLINE	IN-LINE	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	YES	NO	NO	NO
technology	TTL	TTL	TTL	TTL	TTL	TTL	TTL	TTL	TTL
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	MILITARY	MILITARY	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	GULL WING	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maker	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	-	-	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)
Certification status	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified
Base Number Matches	1	1	1	1	1	1	-	-	-

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