MC68HC705P6AP datasheet, PDF - EEWORLD Datasheet

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MC68HC705P6AP: Description8-BIT, OTPROM, 2.1MHz, MICROCONTROLLER, PDIP28, PLASTIC, DIP-28; CategoryThe embedded processor and controller Microcontrollers and processors; File Size532KB，98 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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MC68HC705P6AP Overview

8-BIT, OTPROM, 2.1MHz, MICROCONTROLLER, PDIP28, PLASTIC, DIP-28

MC68HC705P6AP Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	NXP
Parts packaging code	DIP
package instruction	PLASTIC, DIP-28
Contacts	28
Reach Compliance Code	unknown
ECCN code	EAR99
Has ADC	YES
Other features	ALSO OPERATES AT 3.3 V SUPPLY
Address bus width
bit size	8
CPU series	6805
maximum clock frequency	4.2 MHz
DAC channel	NO
DMA channel	NO
External data bus width
JESD-30 code	R-PDIP-T28
JESD-609 code	e0
length	36.83 mm
Number of I/O lines	21
Number of terminals	28
Maximum operating temperature	70 °C
Minimum operating temperature
PWM channel	NO
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP28,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3.3/5 V
Certification status	Not Qualified
RAM (bytes)	176
rom(word)	4672
ROM programmability	OTPROM
Maximum seat height	5.08 mm
speed	2.1 MHz
Maximum slew rate	7 mA
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	NO
technology	HCMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15.24 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER

MC68HC705P6AP Related Products

	MC68HC705P6AP	MC68HC705P6ACDWE	MC68HC705P6ADW	MC68HC705P6ACPE
Description	8-BIT, OTPROM, 2.1MHz, MICROCONTROLLER, PDIP28, PLASTIC, DIP-28	OTPROM, 2.1MHz, MICROCONTROLLER, PDSO28, LEAD FREE, SOIC-28	8-BIT, OTPROM, 2.1MHz, MICROCONTROLLER, PDSO28, SOIC-28	OTPROM, 2.1MHz, MICROCONTROLLER, PDIP28, PLASTIC, LEAD FREE, DIP-28
Maker	NXP	NXP	NXP	NXP
Parts packaging code	DIP	SOIC	SOIC	DIP
package instruction	PLASTIC, DIP-28	LEAD FREE, SOIC-28	SOIC-28	PLASTIC, LEAD FREE, DIP-28
Contacts	28	28	28	28
Reach Compliance Code	unknown	compliant	unknown	compliant
Has ADC	YES	YES	YES	YES
Other features	ALSO OPERATES AT 3.3 V SUPPLY	ALSO OPERATES AT 3.3 V SUPPLY	ALSO OPERATES AT 3.3 V SUPPLY	ALSO OPERATES AT 3.3 V SUPPLY
maximum clock frequency	4.2 MHz	4.2 MHz	4.2 MHz	4.2 MHz
DAC channel	NO	NO	NO	NO
DMA channel	NO	NO	NO	NO
JESD-30 code	R-PDIP-T28	R-PDSO-G28	R-PDSO-G28	R-PDIP-T28
length	36.83 mm	17.925 mm	17.925 mm	36.83 mm
Number of I/O lines	21	21	21	21
Number of terminals	28	28	28	28
Maximum operating temperature	70 °C	85 °C	70 °C	85 °C
PWM channel	NO	NO	NO	NO
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	SOP	SOP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
ROM programmability	OTPROM	OTPROM	OTPROM	OTPROM
Maximum seat height	5.08 mm	2.65 mm	2.65 mm	5.08 mm
speed	2.1 MHz	2.1 MHz	2.1 MHz	2.1 MHz
Maximum supply voltage	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage	5 V	5 V	5 V	5 V
surface mount	NO	YES	YES	NO
technology	HCMOS	CMOS	HCMOS	CMOS
Temperature level	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL
Terminal form	THROUGH-HOLE	GULL WING	GULL WING	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
width	15.24 mm	7.5 mm	7.5 mm	15.24 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER

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