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54112-805182500LF

Description
Board Stacking Connector, 18 Contact(s), 2 Row(s), Male, Straight, 0.1 inch Pitch, Solder Terminal, Black Insulator, Receptacle, ROHS COMPLIANT
CategoryThe connector    The connector   
File Size67KB,1 Pages
ManufacturerAmphenol
Websitehttp://www.amphenol.com/
Environmental Compliance  
Download Datasheet Parametric View All

54112-805182500LF Overview

Board Stacking Connector, 18 Contact(s), 2 Row(s), Male, Straight, 0.1 inch Pitch, Solder Terminal, Black Insulator, Receptacle, ROHS COMPLIANT

54112-805182500LF Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerAmphenol
package instructionROHS COMPLIANT
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresROHS COMPLANT, PLASTIC PKG
body width0.19 inch
subject depth0.984 inch
body length0.9 inch
Body/casing typeRECEPTACLE
Connector typeBOARD STACKING CONNECTOR
Contact to complete cooperationGOLD (15) OVER NICKEL/NICKEL PALLADIUM GOLD OVER NICKEL
Contact completed and terminatedMatte Tin (Sn) - with Nickel (Ni) barrier
Contact point genderMALE
Contact materialPHOSPHOR BRONZE
contact modeRECTANGULAR
Contact styleSQ PIN-SKT
DIN complianceNO
Dielectric withstand voltage1500VAC V
Filter functionNO
IEC complianceNO
Insulation resistance5000000000 Ω
Insulator colorBLACK
insulator materialTHERMOPLASTIC
JESD-609 codee3
MIL complianceNO
Manufacturer's serial number54112
Plug contact pitch0.1 inch
Match contact row spacing0.1 inch
Mixed contactsNO
Installation methodSTRAIGHT
Installation typeBOARD
Number of connectorsONE
PCB row number2
Number of rows loaded2
Maximum operating temperature125 °C
Minimum operating temperature-65 °C
OptionsGENERAL PURPOSE
PCB contact patternRECTANGULAR
PCB contact row spacing2.54 mm
Plating thickness15u inch
Rated current (signal)3 A
GuidelineUL, CSA
reliabilityCOMMERCIAL
Terminal length0.095 inch
Terminal pitch2.54 mm
Termination typeSOLDER
Total number of contacts18
UL Flammability Code94V-0
Base Number Matches1
PDM: Rev:G
STATUS:
Released
Printed: Feb 20, 2009
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