Multiplexer, 1-Func, 8 Line Input, TTL, CDIP16
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Philips Semiconductors (NXP Semiconductors N.V.) |
package instruction | DIP, DIP16,.3 |
Reach Compliance Code | unknown |
Is Samacsys | N |
JESD-30 code | R-XDIP-T16 |
JESD-609 code | e0 |
Logic integrated circuit type | MULTIPLEXER |
MaximumI(ol) | 0.016 A |
Number of functions | 1 |
Number of entries | 8 |
Number of terminals | 16 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP16,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 5 V |
Maximum supply current (ICC) | 48 mA |
Prop。Delay @ Nom-Sup | 52 ns |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | TTL |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Base Number Matches | 1 |
N74151FB | N74LS151B | S54LS151F | S54LS151F/883B | N74151B | S54151W | S54151W/883B | S54151F | S54LS151W | |
---|---|---|---|---|---|---|---|---|---|
Description | Multiplexer, 1-Func, 8 Line Input, TTL, CDIP16 | Multiplexer, 1-Func, 8 Line Input, TTL, PDIP16 | Multiplexer, 1-Func, 8 Line Input, TTL, CDIP16 | Multiplexer, 1-Func, 8 Line Input, TTL, CDIP16 | Multiplexer, 1-Func, 8 Line Input, TTL, PDIP16 | Multiplexer, 1-Func, 8 Line Input, TTL, CDFP16 | Multiplexer, 1-Func, 8 Line Input, TTL, CDFP16 | Multiplexer, 1-Func, 8 Line Input, TTL, CDIP16 | Multiplexer, 1-Func, 8 Line Input, TTL, CDFP16 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
package instruction | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DFP, FL16,.3 | DFP, FL16,.3 | DIP, DIP16,.3 | DFP, FL16,.3 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow | unknow |
JESD-30 code | R-XDIP-T16 | R-PDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-PDIP-T16 | R-XDFP-F16 | R-XDFP-F16 | R-XDIP-T16 | R-XDFP-F16 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
Logic integrated circuit type | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
MaximumI(ol) | 0.016 A | 0.008 A | 0.004 A | 0.004 A | 0.016 A | 0.016 A | 0.016 A | 0.016 A | 0.004 A |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of entries | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
Number of terminals | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
Maximum operating temperature | 70 °C | 70 °C | 125 °C | 125 °C | 70 °C | 125 °C | 125 °C | 125 °C | 125 °C |
Minimum operating temperature | - | - | -55 °C | -55 °C | - | -55 °C | -55 °C | -55 °C | -55 °C |
Package body material | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
encapsulated code | DIP | DIP | DIP | DIP | DIP | DFP | DFP | DIP | DFP |
Encapsulate equivalent code | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | FL16,.3 | FL16,.3 | DIP16,.3 | FL16,.3 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | FLATPACK | FLATPACK | IN-LINE | FLATPACK |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Maximum supply current (ICC) | 48 mA | 10 mA | 10 mA | 10 mA | 48 mA | 48 mA | 48 mA | 48 mA | 10 mA |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO | NO | NO | YES | YES | NO | YES |
technology | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
Temperature level | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL | MILITARY | MILITARY | MILITARY | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT | FLAT | THROUGH-HOLE | FLAT |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Maker | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
Prop。Delay @ Nom-Sup | 52 ns | 42 ns | 42 ns | 42 ns | 52 ns | 52 ns | 52 ns | - | - |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | - | - | - | - |
Certification status | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |